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Thermal and Mechanical Challenges of Test Handlers | Ernest Blanco
In this presentation Ernest Blanco addresses several challenges relating to testing IC devices and the need for more robust pick and place processes along with the precision alignment of the device under test (DUT) to the contact pines.This paper was presented at TestConX 2023.
Testing Next Generation OLED Display Driver ICs | Chris Lemoine
In this presentation Chris Lemoine presents the trends and challenges of testing next generation OLED display driver ICs, including TDDI for mobile, home, enterprise and automotive applications. This paper was presented at Semicon Korea 2023.
True Known Good Die Solution for SiC Power Die Testing | Serge Künzli
One of the Key elements to guarantee the quality and reliability of SiC bare dies is the capabilities to test, inspect and sort the dies after singulation and prior final assembly in power module. The NY32W Know Good Die (KGD) together with the cGator contactor and NV-Core inspection system offers an all-in-one test and inspection solution for high-power SiC bare die’s providing a lower cost of test. This paper was presented at Semicon Japan 2022.
The Challenges in Testing Small and Highly Integrated Devices in a Massive Parallel Test System | Markus Wagner
The triumph of electronic components started in the 1950s with the introduction of semiconductor transistors. Since this time the content of electronics has risen significantly. Innovations in the semiconductor industry are supporting the megatrends like mobility car electrification including ADAS-systems, sensors, connectivity, and advanced security. In this presentation, Markus Wagner describes the development of a test contactor for singulated, small WLCSP devices in massive parallelism test, supporting more than 200 contact sites and how different aspects address the challenges of reliable and cost-efficient device testing. This paper was presented at Semicon Europa 2022.
Evolution of 55 GHz Octal-site Wafer Test Probe Card for 5G mmWave devices | Peter Cockburn
One of the most demanding test applications today is high volume production wafer test of 5G mmWave devices at speed. In this presentation Peter Cockburn discusses how mmWave interfaces operating at 55 GHz require impedance matching to 35 Ohms. RF simulation of the complete probe head and PCB signal paths was used to define a new design that met expected performance goals. Implementation required a new probe-head cross section with a custom ground probe and modified PCB trace structures on surface and embedded layers. This paper was presented at SWTest 2022.
Addressing Test Cell Challenges to Accelerate Time to Yield | Ian Lawee
The time pressure to develop and aggressively ramp new products at high yield is increasing across all semiconductor segments. In this presentation, Ian Lawee will outline these time to yield challenges. He also explains how Cohu’s test cell first approach creates more flexible test cell solutions to be targeted at multiple device technologies which can shorten the cycle time to first-pass success for a portfolio of devices at high throughput and yield. This paper was presented at Semicon Korea 2022.
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