• Careers
  • Help Center
  • Login
cohu.com
MENUMENU
  • Products
    • Test Handlers
      • Pick-and-Place
        • Eclipse
        • MATRiX
        • MT9510
      • Gravity
        • MT9928 xm
        • Rasco SO1000
        • Rasco SO2000
      • Turret Test and Scan
        • Ismeca NY20
        • Ismeca NY32
        • Ismeca NY32W
        • Neon
        • Wide Bandgap Test Solutions
      • MEMS and Sensor Test
        • Sense+ Automation Platform
        • Inertial Test
        • Magnetic Sensor Test
        • Microphone Test
        • Optical Sensor Test
        • Pressure Test
      • Markets
        • Automotive
        • Computing
        • Consumer
        • Industrial
        • IoT/IoV and Optoelectronics
        • Mobile
      • Test Handler Solutions

        Test Handler Group

        Read More
      • Thermal
        • T-Core Active Thermal Control
        • Temperature Chambers
      • High Parallel Test
        • Film Frame FH-1200
        • InCarrier
        • Laser Mark MH-3300
        • NY32-LU
        • Rasco Jaguar
        • Sense+ Automation Platform
        • SH-5300
      • Smart Factory Automation
    • Semiconductor Testers
      • Application Solutions
        • Automotive
        • Consumer
        • Flat Panel Display
        • Industrial
        • Internet of Things
        • Microcontrollers
        • Mobile
        • Power Management
        • Wireless / RF
      • Test Systems
        • Diamondx
        • Diamondx DxV
        • PAx
      • Instrumentation
        • Diamondx Instrumentation
        • PAx Instrumentation
        • Wireless / RF Instrumentation
      • EducATE
      • Application Services
        • Software
      • Semiconductor Tester Solutions

        Semiconductor ATE

        Read More
    • Interface Solutions
      • Key Test Requirement
        • Automotive and Power
        • High End Digital
        • Mobile
        • Precision Analog and Sensors
        • RF
      • Package Type
        • BGA
        • QFN / DFN / MLF
        • QFP
        • SO
        • WLCSP
        • ECT Industrial Contacts
        • Kita Advanced Spring Probes
      • Interface Products
        • ACE Contactor / Probe Head
        • Atlas Contactor / Probe Head
        • cBoa Contactor / Probe Head
        • cCompact Kelvin Contactor
        • cCruiser Contactor
        • cDragon Contactor
        • cGator Contactor
        • cHybrid Turret Contactor
        • cPython Contactor / Probe Head
        • cRacer Contactor / Probe Head
        • cViper Probe Head
        • ecoAmp Kelvin Contactor
        • E-Series Spring Probe Contactor
        • Gemini Kelvin Contactor / Probe Head
        • Hydra Contactor / Probe Head
        • ICON Coaxial Contactor
        • Mercury Contactor / Probe Head
        • MiCon Contactor
        • nanoKelvin Contactor
        • RF Scrub Contactor
        • ULTRA-S Contactor
        • Wafer Probe Cards
        • xWave Contactor / Probe Head
      • Interface Solutions

        Interface Solutions Group

        Read More
      • Interface Technology
        • Cantilever
        • Kelvin
        • Spring Probe
    • Inspection and Metrology
      • WLCSP Inspection
        • Neon
      • Package Inspection
        • Krypton
        • Ismeca NY20
        • Ismeca NY32
      • NV-Core Inspection System
        • 3D Flex Vision System
        • Aquilae HR Sidewall Module
        • Aquilae Infrared Module
      • Markets
        • Automotive
        • Computing
        • Consumer
        • IoT/IoV and Optoelectronics
        • Industrial
        • Mobile
      • Inspection and Metrology Solutions

        Test Handler Group

        Read More
    • Data Analytics
      • DI-Core Data Intelligence System
        • About DI-Core
        • AI Inspection
        • InSight
        • Predictive Maintenance
        • SmartTrak
      • Tignis, a Cohu Analytics Solution
        • About Tignis
        • PAICe Monitor
        • PAICe Maker
        • Case Studies
        • Tignis Blog
        • Tignis Careers
        • Request a Demo
      • Industries
        • Semiconductor Components and Material Suppliers
        • Semiconductor Equipment Manufacturers
        • Semiconductor Fabricators
  • Expertise
    • Expertise
      • Markets
        • Automotive
        • Computing
        • Consumer
        • Industrial
        • IoT/IoV and Optoelectronics
        • Mobile
      • Expert Papers
        • EducATE Knowledge Center
        • Technical Papers
        • Tignis Blog
      • Test Cell Solutions
        • Data Analytics
        • Wide Bandgap Test Solutions
      • Expertise

  • Sales and Service
    • Sales and Service
      • Customer Platforms
        • Customer Portal
        • EducATE Knowledge Center
      • Support
        • Help Center
        • Contact Sales
        • Contact Service
        • Locations
      • Service Offerings
        • Service Based Support (SBS)
        • OEM Protect Program
        • Boost Installed Base ROI
        • Reduce Spares Turnaround
        • Refurbished ATE Equipment
      • Training Offerings
        • Handler and Inspection Training
        • Tester Training
      • Sales and Service

  • Company
    • Company
      • Our Company
        • About Us
        • Cohu History
        • Leadership Team
        • Locations
      • Environment, Social & Governance
        • Corporate Responsibility
        • Corporate Sustainability
      • News and Events
        • Industry Events
        • Press Releases
      • Investor Relations
        • Investor Overview
        • Documents and Charters
        • Board of Directors
        • Annual Reports
        • SEC Filings
        • Press Releases
        • Stock Information
      • Careers
        • Careers at Cohu
        • Working at Cohu
        • Our Culture
        • Search Job Opportunities
        • Students and Co-Ops
        • Policies
        • Ausbildung – Studenten
        • Recruiters
      • Company

  • Click to open the search input field Click to open the search input field Search
You are here: Home1 / Expertise2 / Technical Papers

Technical Papers

2025



Improving DDIC Signal Capture Accuracy via simulation-based compensation for Parasitic Capacitance | James JinSoo Ko
In this presentation, JinSoo Ko discusses how a SPICE (Simulation Program with Integrated Circuit Emphasis) simulation technique measures signal line parasitic capacitance accurately and mathematically to compensate it out from captured data and derive the correct DDIC source driver output load capacitance.


View the Presentation



Optimizing Waveform fidelity in SERDES & Other high-speed digital application | Wai-Kong Chen
In this presentation, Wai-Kong Chen discusses DDIC market trends, the types of pre-emphasis including analog and digital, pre-emphasis use model concept, and how pre-emphasis setting is incorporated in Cohu’s high-speed digital instruments.


View the Presentation


2024



Key Ideas for Developing Advanced Semiconductor Test Solutions | James JinSoo Ko
In this presentation, JinSoo Ko discusses the state of the current semiconductor market, the history of electronics and semiconductor technology, the structure of automated test equipment (ATE) and advanced ATE technology.


View the Presentation



Managing Measurement Path Capacitance in DDIC Source Channel Testing | James JinSoo Ko
In this presentation, JinSoo Ko discusses a solution to improve capacitance changes between capture channels, including load board signal lines, by adjusting the capacitance directly on the channel card or load board, or by mathematically compensating the source signal data using automatic channel capacitance diagnosis technology.


View the Presentation



2023



Cohu's Nigel Beddoe will be presenting a paper about Solving the problem of internal and external noise impact on testing high sensitivity MEMS and sensors at the MEMS and Sensors Technical Congress. There is a rendering of a person's face in shadow and sound waves coming out of their mouth on the left side.Solving the Problem of Internal and External Noise on Impact on Testing High Sensitivity MEMS and Sensors | Nigel Beddoe
In this presentation, Nigel Beddoe discusses the effect of noise on sensitive MEMS devices and how to test these devices, focusing on sensitive MEMS device testing requirements to create optimized testing by eliminated noise and vibration. Nigel’s presentation was the MSTC 2023 Product Showdown runner-up winner.


Watch on YouTube Channel


Simplifying the Process of Probe Card Design through Software Automation | Adam Schultz
In this presentation, Adam Schultz discusses an approach to automating RF simulation for probe cards which significantly reduces simulation errors, lead time, and cost. This poster was presented at SWTest 2023 and was named Winner of 2023 Best Poster.


View the Presentation



Thermal and Mechanical Challenges of Test Handlers | Ernest Blanco
In this presentation Ernest Blanco addresses several challenges relating to testing IC devices and the need for more robust pick and place processes along with the precision alignment of the device under test (DUT) to the contact pines.This paper was presented at TestConX 2023.


View the Presentation



Cohu's Chris Lemoine will be presenting a paper on High resolution OLED display driver IC testing - trends and challenges at Semicon Korea on February 1. There is a grid of 8 x 4 TVs in the background, each showing a different nature scene.

Testing Next Generation OLED Display Driver ICs | Chris Lemoine
In this presentation Chris Lemoine presents the trends and challenges of testing next generation OLED display driver ICs, including TDDI for mobile, home, enterprise and automotive applications. This paper was presented at Semicon Korea 2023.


View the Presentation



2022



True Known Good Die Solution for SiC Power Die Testing | Serge Künzli
One of the Key elements to guarantee the quality and reliability of SiC bare dies is the capabilities to test, inspect and sort the dies after singulation and prior final assembly in power module. The NY32W Know Good Die (KGD) together with the cGator contactor and NV-Core inspection system offers an all-in-one test and inspection solution for high-power SiC bare die’s providing a lower cost of test. This paper was presented at Semicon Japan 2022.


View the Presentation



The Challenges in Testing Small and Highly Integrated Devices in a Massive Parallel Test System | Markus Wagner
The triumph of electronic components started in the 1950s with the introduction of semiconductor transistors. Since this time the content of electronics has risen significantly. Innovations in the semiconductor industry are supporting the megatrends like mobility car electrification including ADAS-systems, sensors, connectivity, and advanced security. In this presentation, Markus Wagner describes the development of a test contactor for singulated, small WLCSP devices in massive parallelism test, supporting more than 200 contact sites and how different aspects address the challenges of reliable and cost-efficient device testing. This paper was presented at Semicon Europa 2022.


View the Presentation



Evolution of 55 GHz Octal-site Wafer Test Probe Card for 5G mmWave devices | Peter Cockburn
One of the most demanding test applications today is high volume production wafer test of 5G mmWave devices at speed. In this presentation Peter Cockburn discusses how mmWave interfaces operating at 55 GHz require impedance matching to 35 Ohms. RF simulation of the complete probe head and PCB signal paths was used to define a new design that met expected performance goals. Implementation required a new probe-head cross section with a custom ground probe and modified PCB trace structures on surface and embedded layers. This paper was presented at SWTest 2022.


Watch on YouTube Channel



Cohu Semicon Korea 2022

Addressing Test Cell Challenges to Accelerate Time to Yield | Ian Lawee
The time pressure to develop and aggressively ramp new products at high yield is increasing across all semiconductor segments. In this presentation, Ian Lawee will outline these time to yield challenges. He also explains how Cohu’s test cell first approach creates more flexible test cell solutions to be targeted at multiple device technologies which can shorten the cycle time to first-pass success for a portfolio of devices at high throughput and yield. This paper was presented at Semicon Korea 2022.


Watch on YouTube Channel



2021



Cohu Mobility Market SolutionsInnovations in Package Testing of 5G mmWave Applications | Aaren Lonks | Don Thompson of R&D Altanova
5G mmWave has a huge impact on the test environment and is revolutionary from a design and implementation standpoint. Learn how the interface for testing 5G mmWave devices must be designed to allow 44 GHz+ signal transmission with minimal loss from the ATE tester to the DUT. This paper was presented at TestConX 2021.


Production Wafer Probe of 77-81 GHz Automotive Radar Applications | Marty Cavegn | Jason Mroczkowski | Jory Twitchell of NXP
Second generation 80 GHz automotive devices are reaching the high-volume production test environment. Learn how an interface solution was developed to test second-generation automotive radar by terminating the 80 GHz signals inside the probe head, as well as provide a path for sourcing a DC voltage to the DUT. This paper was presented at TestConX 2021.


Thermal Control Challenges of High Power DUTs during Test | Jerry Tustaniwskyj |
This paper explains how Cohu’s adaptive thermal management capability (T-Core) enables testing devices at the intended temperature. This paper was presented at MEPTEC 2021.

Cohu Mobility Market SolutionscRacer Concept – Achieving 54+ GHz
Peter Cockburn | Jason Mroczkowski |
A technique to combine traditional spring probe technology with a dielectric-optimized socket architecture to reach 54+ GHz frequencies and deliver high yield with low cost-of-test.  Presented at TestConX 2021.

2020



Matching the production environment with in-house testing | Jason Mroczkowski |
This presentation delivered at TestConX2020 will define the next-generation test methodology and equipment for validating interface hardware during the product development phase. A more sophisticated method of test will be introduced in this presentation. This includes the usage of handling equipment to provide a true high volume production environment in the lab. The methodology introduced here allows many environment variables to be tested simultaneously. No longer is it necessary to cycle and test with different equipment.


5G city OTA Test Solution for 5G / mmWave Band Wireless ICs | Dylan Feng |
Winner of Attendee Choice Award at TestConX 2020. The emerging 5G market creates enormous opportunities for the wireless IC industry. Meanwhile, providing OTA test solution in the new 5G frequency band is recognized as an important requirement. In this paper, a new generation OTA test solution is presented.



2019


OTA Test Solution for High Volume Production Test of AiP Devices | Jason Mroczkowski |
The variety of 5G Antenna in Package (AiP) devices and integrated antenna module pose unique challenges to the production test cell. Test requirements call for Over the Air (OTA) test solution in the mmWave (30 GHz – 100 GHz) frequency bands while most existing OTA solutions are designed only for the lab environment.



On-chip Test with Microstrip Patch Antennas | Dan Campion |
This paper presents a perspective of the development of microstrip antennas for use in WLCSP and WLP semiconductor test. The work that will be discussed includes designing, manufacturing, and installing microstrip patch antenna in contactors and probe heads for test.



WLCSP xWave for high frequency wafer probe application part 2 | Jason Mroczkowski |
Today cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. Packaging has become obsolete and wafers are becoming the new final test package.



OTA Test Solution for Antenna in Package Applications | Jason Mroczkowski |
As we step in 5G area, cell phone makers are turning to AIP ICs. Antenna in Package (or AiP) is a new trend in IC packaging which makes smaller and high integrated ICs that consists of ICs and antenna inside a package.



Closer Tolerance Thermal Management at the Device-Under-Test | Mehdi Attaran |
Effective thermal management has become mandatory for testing devices with faster switching speed transistors that are increasing in numbers in smaller packages. These devices are dissipating more heat while being held at steady test temperature extremes.



Spring Probe WLCSP Probe Head CCC – ISMI Characterization is Not Enough | Valts Treibergs |
A recognized standard for evaluating the CCC (current carrying capacity) of an interconnect used at wafer probe has been the ISMI Probe Council Current Carrying Capability Measurement Guideline, published by International SEMATECH Manufacturing Initiative in 2009.



Solution for mmWave Wafer Probe Applications and Field Results | Jason Mroczkowski |
Today cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. The wafer is becoming the new final test package. Testing automotive radar on wafer at 80 GHz and 150 °C was previously a fantasy, but is now a reality.

Contact Sales

Complete our contact form.

Products

  • Test Handlers
  • Semiconductor Testers
  • Interface Solutions
  • Inspection and Metrology
  • DI-Core Data Intelligence System
  • Tignis, a Cohu Analytics Solution

Expertise

  • Automotive
  • Consumer
  • Computing
  • Industrial
  • IoT/IoV and Optoelectronics
  • Mobility

Sales and Service

  • Customer Portal
  • EducATE Knowledge Center
  • Contact Sales
  • Help Center
  • Locations
  • Service Offerings
  • Training

Company

  • About Us
  • Careers
  • Corporate Responsibility
  • Corporate Sustainability
  • Events
  • Investor Relations
  • Press Releases
© Cohu, Inc 2025
  • Imprint
  • Legal Disclaimer
  • Privacy Policy
Scroll to top Scroll to top Scroll to top
  • Products
    ▼
    • Test Handlers
      ▼
      • Pick and Place
        ▼
        • Eclipse
        • MATRiX
        • MT9510
      • Thermal
        ▼
        • T-Core Active Thermal Control
        • Temperature Chambers
      • Gravity
        ▼
        • MT9928
        • Rasco SO1000
        • Rasco SO2000
        • SH-5300
      • High Parallel Test
        ▼
        • FH-1200
        • InCarrier
        • MH-3300
        • NY32-LU
        • Rasco Jaguar
        • Sense+ Automation Platform
      • MEMS and Sensor Test
        ▼
        • Sense+ Automation Platform
        • Inertial Test
        • Magnetic Sensor Test
        • Microphone Test
        • Optical Sensor Test
        • Pressure Test
      • Turret Test and Scan
        ▼
        • Ismeca NY20
        • Ismeca NY32
        • Ismeca NY32W
    • Semiconductor Testers
      ▼
      • Application Solutions
      • EducATE Knowledge Center
      • Test Systems
        ▼
        • Diamondx
        • Diamondx DxV
        • PAx
      • Instrumentation
        ▼
        • Diamondx Instrumentation
        • PAx Instrumentation
        • Wireless / RF Instrumentation
      • Software
    • Interface Solutions
      ▼
      • Key Test Requirement
      • Interface Technology
      • Package Type
      • Probe Cards
      • Test Contactors
      • Kita Advanced Spring Probes
      • ECT Industrial Contacts
    • Inspection and Metrology
      ▼
      • Package Inspection
        ▼
        • Krypton
        • Ismeca NY20
        • Ismeca NY32
      • WLCSP Inspection
        ▼
        • Neon
      • NV-Core Inspection System
        ▼
        • 3D Flex Vision System
        • Aquilae HR Sidewall Module
        • Aquilae Infrared Module
    • Data Analytics
      ▼
      • DI-Core Data Intelligence System
      • Tignis, a Cohu Analytics Solution
        ▼
        • PAICe Maker
        • PAICe Monitor
        • Case Studies
        • Tignis Blog
        • Tignis Careers
        • Request a Demo
  • Expertise
    ▼
    • Markets
      ▼
      • Automotive
      • Computing
      • Consumer
      • Industrial
      • IoT/IoV and Optoelectronics
      • Mobile
    • EducATE Knowledge Center
    • Technical Papers
    • Test Cell Solutions
  • Sales and Service
    ▼
    • Help Center
    • Customer Portal
    • EducATE Knowledge Center
    • Service Offerings
    • Training Offerings
  • Company
    ▼
    • Our Company
      ▼
      • About Us
      • About Cohu
      • Cohu History
      • Corporate Responsibility
      • Corporate Sustainability
      • Leadership Team
      • Locations
    • Careers
      ▼
      • Careers at Cohu
      • Working at Cohu
      • Culture
      • Students and Co-Ops
      • Search Job Opportunities
    • Events
    • Investor Relations
    • Press Releases