2021

5G mmWave has a huge impact on the test environment and is revolutionary from a design and implementation standpoint. Learn how the interface for testing 5G mmWave devices must be designed to allow 44 GHz+ signal transmission with minimal loss from the ATE tester to the DUT. This paper was presented at TestConX 2021.

Second generation 80 GHz automotive devices are reaching the high-volume production test environment. Learn how an interface solution was developed to test second-generation automotive radar by terminating the 80 GHz signals inside the probe head, as well as provide a path for sourcing a DC voltage to the DUT. This paper was presented at TestConX 2021.

This paper explains how Cohu’s adaptive thermal management capability (T-Core) enables testing devices at the intended temperature. This paper was presented at MEPTEC 2021.

A technique to combine traditional spring probe technology with a dielectric-optimized socket architecture to reach 54+ GHz frequencies and deliver high yield with low cost-of-test. Presented at TestConX 2021.
2020

This presentation delivered at TestConX2020 will define the next-generation test methodology and equipment for validating interface hardware during the product development phase. A more sophisticated method of test will be introduced in this presentation. This includes the usage of handling equipment to provide a true high volume production environment in the lab. The methodology introduced here allows many environment variables to be tested simultaneously. No longer is it necessary to cycle and test with different equipment.

Winner of Attendee Choice Award at TestConX 2020. The emerging 5G market creates enormous opportunities for the wireless IC industry. Meanwhile, providing OTA test solution in the new 5G frequency band is recognized as an important requirement. In this paper, a new generation OTA test solution is presented.
2019

The variety of 5G Antenna in Package (AiP) devices and integrated antenna module pose unique challenges to the production test cell. Test requirements call for Over the Air (OTA) test solution in the mmWave (30 GHz – 100 GHz) frequency bands while most existing OTA solutions are designed only for the lab environment.

This paper presents a perspective of the development of microstrip antennas for use in WLCSP and WLP semiconductor test. The work that will be discussed includes designing, manufacturing, and installing microstrip patch antenna in contactors and probe heads for test.

Today cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. Packaging has become obsolete and wafers are becoming the new final test package.

As we step in 5G area, cell phone makers are turning to AIP ICs. Antenna in Package (or AiP) is a new trend in IC packaging which makes smaller and high integrated ICs that consists of ICs and antenna inside a package.

Effective thermal management has become mandatory for testing devices with faster switching speed transistors that are increasing in numbers in smaller packages. These devices are dissipating more heat while being held at steady test temperature extremes.


A recognized standard for evaluating the CCC (current carrying capacity) of an interconnect used at wafer probe has been the ISMI Probe Council Current Carrying Capability Measurement Guideline, published by International SEMATECH Manufacturing Initiative in 2009.

Today cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. The wafer is becoming the new final test package. Testing automotive radar on wafer at 80 GHz and 150 °C was previously a fantasy, but is now a reality.