2023
Simplifying the Process of Probe Card Design through Software Automation | Adam Schultz
Thermal and Mechanical Challenges of Test Handlers | Ernest Blanco
In this presentation Ernest Blanco addresses several challenges relating to testing IC devices and the need for more robust pick and place processes along with the precision alignment of the device under test (DUT) to the contact pines.This paper was presented at TestConX 2023.
Testing Next Generation OLED Display Driver ICs | Chris Lemoine
In this presentation Chris Lemoine presents the trends and challenges of testing next generation OLED display driver ICs, including TDDI for mobile, home, enterprise and automotive applications. This paper was presented at Semicon Korea 2023.
2022
True Known Good Die Solution for SiC Power Die Testing | Serge Künzli
One of the Key elements to guarantee the quality and reliability of SiC bare dies is the capabilities to test, inspect and sort the dies after singulation and prior final assembly in power module. The NY32W Know Good Die (KGD) together with the cGator contactor and NV-Core inspection system offers an all-in-one test and inspection solution for high-power SiC bare die’s providing a lower cost of test. This paper was presented at Semicon Japan 2022.
The Challenges in Testing Small and Highly Integrated Devices in a Massive Parallel Test System | Markus Wagner
The triumph of electronic components started in the 1950s with the introduction of semiconductor transistors. Since this time the content of electronics has risen significantly. Innovations in the semiconductor industry are supporting the megatrends like mobility car electrification including ADAS-systems, sensors, connectivity, and advanced security. In this presentation, Markus Wagner describes the development of a test contactor for singulated, small WLCSP devices in massive parallelism test, supporting more than 200 contact sites and how different aspects address the challenges of reliable and cost-efficient device testing. This paper was presented at Semicon Europa 2022.
Evolution of 55 GHz Octal-site Wafer Test Probe Card for 5G mmWave devices | Peter Cockburn
One of the most demanding test applications today is high volume production wafer test of 5G mmWave devices at speed. In this presentation Peter Cockburn discusses how mmWave interfaces operating at 55 GHz require impedance matching to 35 Ohms. RF simulation of the complete probe head and PCB signal paths was used to define a new design that met expected performance goals. Implementation required a new probe-head cross section with a custom ground probe and modified PCB trace structures on surface and embedded layers. This paper was presented at SWTest 2022.
Addressing Test Cell Challenges to Accelerate Time to Yield | Ian Lawee
The time pressure to develop and aggressively ramp new products at high yield is increasing across all semiconductor segments. In this presentation, Ian Lawee will outline these time to yield challenges. He also explains how Cohu’s test cell first approach creates more flexible test cell solutions to be targeted at multiple device technologies which can shorten the cycle time to first-pass success for a portfolio of devices at high throughput and yield. This paper was presented at Semicon Korea 2022.
2021
Innovations in Package Testing of 5G mmWave Applications | Aaren Lonks | Don Thompson of R&D Altanova5G mmWave has a huge impact on the test environment and is revolutionary from a design and implementation standpoint. Learn how the interface for testing 5G mmWave devices must be designed to allow 44 GHz+ signal transmission with minimal loss from the ATE tester to the DUT. This paper was presented at TestConX 2021.
Production Wafer Probe of 77-81 GHz Automotive Radar Applications | Marty Cavegn | Jason Mroczkowski | Jory Twitchell of NXPSecond generation 80 GHz automotive devices are reaching the high-volume production test environment. Learn how an interface solution was developed to test second-generation automotive radar by terminating the 80 GHz signals inside the probe head, as well as provide a path for sourcing a DC voltage to the DUT. This paper was presented at TestConX 2021.
Thermal Control Challenges of High Power DUTs during Test | Jerry Tustaniwskyj |This paper explains how Cohu’s adaptive thermal management capability (T-Core) enables testing devices at the intended temperature. This paper was presented at MEPTEC 2021.
cRacer Concept – Achieving 54+ GHz A technique to combine traditional spring probe technology with a dielectric-optimized socket architecture to reach 54+ GHz frequencies and deliver high yield with low cost-of-test. Presented at TestConX 2021.
2020
Matching the production environment with in-house testing | Jason Mroczkowski |This presentation delivered at TestConX2020 will define the next-generation test methodology and equipment for validating interface hardware during the product development phase. A more sophisticated method of test will be introduced in this presentation. This includes the usage of handling equipment to provide a true high volume production environment in the lab. The methodology introduced here allows many environment variables to be tested simultaneously. No longer is it necessary to cycle and test with different equipment.
OTA Test Solution for 5G / mmWave Band Wireless ICs | Dylan Feng |Winner of Attendee Choice Award at TestConX 2020. The emerging 5G market creates enormous opportunities for the wireless IC industry. Meanwhile, providing OTA test solution in the new 5G frequency band is recognized as an important requirement. In this paper, a new generation OTA test solution is presented.
2019
OTA Test Solution for High Volume Production Test of AiP Devices | Jason Mroczkowski |The variety of 5G Antenna in Package (AiP) devices and integrated antenna module pose unique challenges to the production test cell. Test requirements call for Over the Air (OTA) test solution in the mmWave (30 GHz – 100 GHz) frequency bands while most existing OTA solutions are designed only for the lab environment.
On-chip Test with Microstrip Patch Antennas | Dan Campion |This paper presents a perspective of the development of microstrip antennas for use in WLCSP and WLP semiconductor test. The work that will be discussed includes designing, manufacturing, and installing microstrip patch antenna in contactors and probe heads for test.
WLCSP xWave for high frequency wafer probe application part 2 | Jason Mroczkowski |Today cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. Packaging has become obsolete and wafers are becoming the new final test package.
OTA Test Solution for Antenna in Package Applications | Jason Mroczkowski |As we step in 5G area, cell phone makers are turning to AIP ICs. Antenna in Package (or AiP) is a new trend in IC packaging which makes smaller and high integrated ICs that consists of ICs and antenna inside a package.
Closer Tolerance Thermal Management at the Device-Under-Test | Mehdi Attaran |Effective thermal management has become mandatory for testing devices with faster switching speed transistors that are increasing in numbers in smaller packages. These devices are dissipating more heat while being held at steady test temperature extremes.
Spring Probe WLCSP Probe Head CCC – ISMI Characterization is Not Enough | Valts Treibergs |A recognized standard for evaluating the CCC (current carrying capacity) of an interconnect used at wafer probe has been the ISMI Probe Council Current Carrying Capability Measurement Guideline, published by International SEMATECH Manufacturing Initiative in 2009.
Solution for mmWave Wafer Probe Applications and Field Results | Jason Mroczkowski |Today cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. The wafer is becoming the new final test package. Testing automotive radar on wafer at 80 GHz and 150 °C was previously a fantasy, but is now a reality.
