FH-1200™ film frame test handler is designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages. The FH-1200 enables high parallelism testing of post-saw IC devices at ambient temperature. It can accommodate 200 mm and 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. No change kits are required regardless of package size (if same frame is used).
Product Information
| Description | FH-1200 |
|---|---|
| Changeover (frame size, load board) | Less than 15 minutes |
| Device Changeover (Recipe Change) | Less than 1 minute |
| Multi-site Test | Single site to massively parallel |
| Temperature | Ambient; hot capability available shortly |
| Jam Rate | Less than 1 jam in 1000 rings run |
| Film Frame Carriers Supported | Standard frames for 200 mm and 300 mm wafer rings |
| Maximum number of Cassette | 2 input and 2 output cassettes, 1 reject cassette with reduced number of slots, on output side |
| Package Types | QFN/QFN lead frames, WLCSP, other tape mounted package types |
| Reject Mark Laser | Rofin, Alltec, Keteca (other integrated upon requested) |
| Data Collection, Reporting | Full compatibility with Cell Controller/Smart Track |
| Contactor Compatibility | Both pogo pin style strip contactors and probe cards |
| Docking Method | Both direct or cable docking |
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