MCT FH-1200
High-Throughput Film Frame Test Handler

FH-1200™ film frame test handler is designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages. The FH-1200 enables high parallelism testing of post-saw IC devices at ambient temperature. It can accommodate 200 mm and 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. No change kits are required regardless of package size (if same frame is used).

Supports Ultra-High Parallelism Testing

The FH-1200 film frame handler is our 3rd generation bringing unparalleled flexibility and features to this market segment. It can accommodate 200 mm, 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. The high parallelism, post-saw testing is made possible by the use of sophisticated alignment and contacting algorithms.

The FH-1200 film frame handler represents the very latest in advanced technology for this class of machines. Superior contacting methodology avoids package cracking. The innovative I/O structure makes re-testing simple and easy.

For QFN and DFN devices, exclusive use of an optional Reject Mark LaserTM (RML) enables the FH-1200 to dramatically lower End-of-Line taping costs and to improve the quality of devices loaded to tape-and-reel by eliminating any chance of test escapes.



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No Package Size Limitations

8" or 12" Wafer or Custom Rings

Optional Reject Mark Laser

Key Features


Wafer Ring Support

Accommodating both industry standard 8″ or 12″ wafer rings or custom rings. Allowing wafer rings to be customized to accommodate layouts to maximize the number of strips that can be mounted on a given wafer ring, thereby lowering tape costs.



High Productivity

No change kits are required, regardless of package size. The FH-1200 handles the wafer ring, not individual strips. Only the contactor and load board need to change.



Optional Reject Mark Laser

With the optional built-in Reject Mark Laser rejects are marked immediately after test and before the vacuum is released to avoid test escapes. The Reject Mark Laser enables high-speed End-of-Line tape-and-reel for QFNs and includes online verification of the reject marks, providing higher End-of-Line quality.



End-of-Line Processing

With the use of an optional Reject Mark Laser, it allows for two End-of-Line processing options for process flow for block molded QFN/DFN packages. The Pick method uses a Die Picker that is driven by the strip map. The Bulk method uses a simple turret handler with vision sorting.



Versatility

The FH-1200 can be configured as a test development system to test as little as one device at a time, or as a high-volume manufacturing system to test over 100 post-sawn parts in parallel.



Ultra-Small QFN Testing

Field-proven ability to test ultra-small QFN devices 0.3 x 0.6 already run in high-volume production.


Product Information


DescriptionFH-1200
Changeover (frame size, load board)Less than 15 minutes
Device Changeover (Recipe Change)Less than 1 minute
Multi-site TestSingle site to massively parallel
TemperatureAmbient; hot capability available shortly
Jam RateLess than 1 jam in 1000 rings run
Film Frame Carriers SupportedStandard frames for 200 mm and 300 mm wafer rings
Maximum number of Cassette2 input and 2 output cassettes, 1 reject cassette with reduced number of slots, on output side
Package TypesQFN/QFN lead frames, WLCSP, other tape mounted package types
Reject Mark LaserRofin, Alltec, Keteca (other integrated upon requested)
Data Collection, ReportingFull compatibility with Cell Controller/Smart Track
Contactor CompatibilityBoth pogo pin style strip contactors and probe cards
Docking MethodBoth direct or cable docking

Expertise

Learn more about our Test Handler and Inspection Solutions