WLCSP Package Interface Solutions
Challenges and Solutions for Contacting Wafer-Level Chip Scale Package Devices
Wafer Level Chip Scale Packages have been in use for over a decade years now, and the number of devices packed this way continues to grow at a significant pace. WLCSPs are primarily choice for mobile devices for this reason.
The other reasons to package at the wafer level are economic: The packaging itself is inexpensive and packaging at the wafer level allows testing at the wafer level. Final testing at the wafer level eliminates a test step compared the traditional wafer probe + final test.