T-Core Thermal System

Scalable Multi-Channel Active Thermal Control (ATC)

T-Core best in class temperature control for high volume manufacturing, delivers yield advantage for Cohu’s Pick and Place Handlers

Wide test temperature range from -55°C to +155°C
Device power dissipation >1000W
Ultra fast thermal response for low Tj rise via device temperature or device power feedback
Precise temperature guardband ± 1°C

Capabilities
- Innovation in high speed Active Thermal Control with over 50 patents
- Adaptable for Engineering Dvlp., Test, Burn-in, and System-level Test
- Full data correlation to multi-site Cohu test handlers
- Scalable architecture to support high test parallelism
- Supports tri-temp testing with single insertion
- Intuitive, configurable software user interface

Key Features
- High-speed closed-loop Active Thermal Control
- Flexible control loop, leveraging device power or diode temperature
- Fast temperature ramp up to 200°C/second
- Active Flow Control (AFC) with closed-loop regulation based on heater power for optimum thermal response
- NIST traceable thermal calibrated thermal heads
- High speed data log up to 1ms sampling rate
- Field Upgradable

Available Options
- Active Flow Control (AFC)
- Control PC
- Power Summing Interface
- Digital Interface

Available on Test Handlers

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