T-Core™ thermal system provides industry-leading Active Thermal Control (ATC) up to 800 W power dissipation. T-Core dynamically compensates device overheating, minimizing yield loss.
Scalable Multi-Channel True ATC
Cohu’s proprietary T-Core thermal system’s controller provides precise, multi-site temperature management of power dissipation ICs, such as graphic chips and CPUs, optimizing test yield.
The T-Core thermal control system optimizes test yield at cold, ambient, and hot temperatures and offers better than +/- 1°C accuracy with response speeds of >125°C/sec. The system’s flexibility to control air, liquid, and refrigerant based thermal heads gives semiconductor manufacturers excellent temperature control capability for high volume manufacturing.
T-Core’s modularity and small form factor enable cost effective, seamless integration into Cohu’s pick-and-place handlers. T-Core provides customers with a single thermal system solution, from engineering development to final test volume production.
T-Core best-in-class temperature control for high volume manufacturing delivers yield advantage for Cohu’s pick and place handlers:
- Industry-leading Active Thermal Control (ACT) for up to 800 W power dissipation
- Full data correlation to multi-site ATC handlers
- Scalable architecture to support multiple sites with 3 RTD sensors per site
- Support tri-temp testing with single insertion
- Intuitive, configurable software user interface
Low to 800 W Power Dissipation
Field Upgradable
Available on MATRiX
Available Options
- Active Flow Control (AFC)
- Control PC
- Power Summing Interface
- Digital Interface
Available on Eclipse
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