T-Core Thermal System

Scalable Multi-Channel Active Thermal Control (ATC)

T-Core best in class temperature control for high volume manufacturing, delivers yield advantage for Cohu’s Pick and Place Handlers

  • Wide test temperature range from -55°C to +155°C
  • Device power dissipation >1000W
  • Ultra fast thermal response for low Tj rise via device temperature or device power feedback
  • Precise temperature guardband ± 1°C
  • Capabilities

    • Innovation in high speed Active Thermal Control with over 50 patents
    • Adaptable for Engineering Dvlp., Test, Burn-in, and System-level Test
    • Full data correlation to multi-site Cohu test handlers
    • Scalable architecture to support high test parallelism
    • Supports tri-temp testing with single insertion
    • Intuitive, configurable software user interface
  • Key Features

    • High-speed closed-loop Active Thermal Control
    • Flexible control loop, leveraging device power or diode temperature
    • Fast temperature ramp up to 200°C/second
    • Active Flow Control (AFC) with closed-loop regulation based on heater power for optimum thermal response
    • NIST traceable thermal calibrated thermal heads
    • High speed data log up to 1ms sampling rate
    • Field Upgradable
  • Available Options

    • Active Flow Control (AFC)
    • Control PC
    • Power Summing Interface
    • Digital Interface