Ismeca NY32W
Flexible Test and Scan Solution for FFC Devices
32-position turret test and scan platform for semiconductors on film-frame wafer media, providing the highest inspection yield for WLCSP and Bare Dies. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity.
The NY32W also integrates Cohu’s latest advanced inspection technologies such as 3D Flex® for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.