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Ismeca NY32W

Flexible Test and Scan Solution for FFC Devices

32-position turret test and scan platform for semiconductors on film-frame wafer media, providing highest inspection yield for WLCSP and Bare Dies. Integrating innovative hardware and software technologies such as intelligent features that enables extended autonomous operation and productivity.

The NY32W also integrates Cohu’s latest advanced inspection technologies such as, 3D Flex® for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

Product Sheet

  • Process Flexibility

    • Up to 12″ Wafer Input
    • 180° Flip-Chip under Turret
    • 6 Sides Inspection
    • Tape and Reel Output
    • In-Tape inspection with Auto-Reject and Replacement

  • Productivity

    • Up to 30,000 UPH
    • Complete Finishing Solution
      – Full Vision Inspection
      – Test Contacting
      – KGD Automotive Bare Die Testing
    • Full Device Traceability

  • Device Type

    • Wide Applicable Device Range
      (0.3 x 0.6 mm to 12 x 12 mm)
      – Bare Die, Bumped Die
      – QFN /DFN
      – LED
      – MEMS

  • Available Options

    • Micro-crack Detection
    • Inner Micro-crack Detection with IR
    • LED / Laser LED Testing (full flux or intensity)
    • LED Sorting
    • ViewMap® on Wafer Input
    • Detaping Input
    • 3D Flex® Inspection
    • Laser Marking Integration
    • Auto Reel Changer (ARC)

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