Ismeca NY32W
Flexible Test and Scan Solution for Film Frame Carrier Devices

NY32W™ and NY32W™ KGD turret test handler is a fully automatic optical testing, visual inspection and bare die sorting solution. This innovative solution provides customers with the stringent quality required for the automotive industry, while delivering higher productivity and lower cost.

All-in-One Test and Handling Solution

The NY32W and NY32W KGD is a 32-position turret test and scan platform for semiconductors on film-frame wafer media, providing the highest inspection yield for wafer-level chip scale and bare dies. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity.

A complete finishing solution with full vision inspection, test contacting, with up to 12″ Wafer Input with 180° Flip-Chip under Turret.

The NY32W features Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

Featuring Cohu’s PAICe Digital Twin Platform providing real-time equipment monitoring and data analytics for Industry 4.0/Factory Automation.

The platform is well suited for radio frequency (RF) devices, small power management ICs, singulated high-power Known Good Die (KGD), solid state lighting devices, such as LEDs, LiDAR and many other ICs in wafer-level chip scale packaging.



Cohu NV-Core Inspection System


Power Diodes

Power MOSFET

Power IGBT

Cohu Ismeca NY32W Turret and Inspection Test Handler

NY32W

Electric Vehicles (xEV)

Industrial Power Applications

LED and Sensors

Key Features


High Productivity

Up to 30,000 UPH in a complete finishing solution, and up to 7,000 UPH @ 150 ms test time for Known Good Die in a complete finishing solution.



Package Sizes

Wide applicable device range 0.3 x 0.6 mm to 12 x 12 mm package handling. Bare Die, Bumped Die, QFN/DFN, LED and MEMS.



Thin Bare Die Handling and Testing

Production-proven delicate  thin bare die handling down to 70 μm and Known Good Die Automotive testing down to 50 μm.



High Power

High power post singulation testing up to 3,500 V / 1000 V for Known Good Die, through single insertion with final inspection and full traceability from Wafer Input to Tape & Reel Output.



Full Device Traceability

Device ID traceability and process flow.



Advanced Vision with Infrared Technology

Ability to see through silicon, inspecting the structure underneath the surface; top, bottom, side and in-tape infrared inspection for improved production yield.



Cohu NV-Core Inspection System

Available Options

  • LED / Laser LED Testing (full flux or intensity)
  • LED Sorting
  • Detaping Input
  • Laser Marking Integration
  • Auto Reel Changer (ARC)


Software Analytics Options

PAICe Digital Twin Platform

  • Real-time equipment monitoring and management
  • Preventative Maintenance
  • Central Recipe Management
  • Knowledge Database and Unified Reports

SiC and GaN Wide Bandgap Test Cell Solutions

Cohu’s production-proven test cell solutions enable the high-voltage and high-current requirements to ramp power bare die silicon carbide (SiC) MOSFETs and Schottky diodes, and gallium nitride high electron mobility transistors (GaN HEMTs) automotive and industrial devices. Patent pending Volta-flux high-power density solution enables identical contact elements for singulated power Known Good Die (KGD) and wafer probing, with field-replaceable MEMS probes providing significantly lower cost of test.


Singulated Power KGD Test Cell Solution iCohu equipment, the NY32W, cGator contactor and cStrider probe card.

Expertise

Learn more about our Inspection and Metrology Solutions