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Ismeca NY32W

Highest Inspection Yield for Wafer Level Chip Scale Packages and Bare Dies

32-position turret platform for semiconductors on film-frame wafer media, providing highest inspection yield. Integrating innovative hardware and software technologies such as intelligent features that enables extended autonomous operation and productivity.

The NY32W also integrates Cohu’s latest advanced inspection technologies such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

  • Process Flexibility

    • Up to 12″ Wafer Input
    • 180° Flip-Chip under Turret
    • 6x Sides Inspection
    • Tape and Reel Output
    • In-Tape inspection with Auto-Reject and Replacement

  • Productivity

    • Up to 30,000 UPH
    • Complete Finishing Solution
      – Full Vision Inspection
      – Test Contacting
    • Full Device Traceability
  • Device Type

    • Wide Applicable Device Range
      (0.3 x 0.6 mm to 12 x 12 mm)
      – WLCSP: Bare Die, Bumped Die
      – QFN /DFN
      – LED
      – MEMS
  • Available Options

    • Micro-crack Detection
    • Inner Micro-crack Detection with IR
    • LED / Laser LED Testing (full flux or intensity)
    • LED Sorting
    • ViewMap on Wafer Input
    • Detaping Input
    • 3D Flex Inspection
    • Laser Marking Integration
    • Auto Reel Changer (ARC)