All-in-One Test and Handling Solution

32-position turret test and scan platform for semiconductors on film-frame wafer media, providing the highest inspection yield for wafer-level chip scale and bare dies. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity.

A complete finishing solution with full vision inspection, test contacting, with up to 12″ Wafer Input with 180° Flip-Chip under Turret.

The NY32W features Cohu’s latest advanced inspection technologies such as 3D Flex® for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

The platform is well suited for radio frequency (RF) devices, small power management ICs, high-power Known Good Die (KGD), solid state lighting devices, such as LEDs, LiDAR and many other ICs in wafer-level chip scale packaging.