3D Flex Vision System
Measurement equipment into the volume production environment for Wafer Chip Scale Level Package (WLCSP) Inspection
The 3D Flex Vision system is well suited for inspection of semiconductor products used in mobility and wireless communications markets, such as RF devices, small power management ICs and many other devices in wafer level chip scale package (WLCSPs).
Based on Moiré interferometry, the 3D Flex Vision system combines a sequence of touchless 2-dimensional images with projected light patterns to generate high accuracy 3-dimensional measurement of inspected devices. A dedicated algorithm generates a topographic view of devices, accurately measuring ball or bump height, coplanarity, quality and body warpage, enabling high-speed inspection of WLCSPs with micrometer resolution.
True Ball/Bump co-planarity