Delta Eclipse XT

Highly Configurable Scalable Pick and Place Handler

Eclipse XT delivers scalable performance for testing a wide range of semiconductors, from analog ICs to high performance mobile processors.  The Eclipse XT is a high speed pick-and-place handler designed to test up to 16 Integrated Circuits (ICs) in parallel, at temperatures from -45°C to +155°C*, with throughput up to 13,000 units per hour.

Featuring Cohu’s  proprietary T-Core thermal controller and a variety of cooling systems in order to provide precise, multi-site temperature management of power dissipative ICs, optimizing test yield of next generation IC’s. It also enables both IDM and Fabless customers to test high-end processors used in augmented virtual reality and deep-learning applications, giving continuity to Cohu’s leadership in advanced thermal test. Eclipse XT offers flexibility for both OSATs, IDM and Fabless customers with its wide market coverage through field configurability.

*device type dependent

  • Key Features

    • Up to 13,000 max UPH
    • Ambient to 130°C
    • Parallelism x1 up to x16
    • Output bins: 3 auto, 3 manual
    • OSAT device kit compatible
    • Auto Contactor Cleaning (ACC)
    • Contactor force: 250 Kgf standard, 500 Kfg optional
    • GPIB, SECS/GEM, RS-232
  • Flexibility

    • Wide market coverage through field configurability
    • Best-in-class T-Core Active Thermal Control (ATC)
    • >1000W DUT power dissipation (with tri-temp option)
    • Start of test temperature control
    • NIST Traceable Thermal Calibration
    • 3×3 to 80×80 mm packages
    • Docking horizontal, rear and side
    • JEDEC Tray based packages
    • Load / Unload on the fly
  • Available Options

    • Tri-temp -45°C to +155°C (Chamber-less, Soak on Head)*
    • Auto Retest
    • DTM (Contactor Conditioning)
    • DUT Rotation
    • Liquid and Mechanical TIM
    • Manual RFID
    • 207 Kgf Socket Force
    • Vision 2DID, u2DID, OCR
    • In-Socket Vision-based Device Detection
    • Air-Cooled and Water-Cooled Chillers to -70°C
    • Thermal (heated) CDP

    *device type dependent

  • Applications

    • Application Processors (mobile)
    • Automotive Processors
    • CPU and Servers (computing)
    • GPU/AI (graphics)
    • IoT