Configuration Flexibility
Eclipse™ platform is Cohu’s scalable pick-and-place test handler solution, engineered to support the full spectrum of semiconductor devices, from analog ICs, mobile processors to AI datacenter devices – including GPUs, CPUs, custom AI accelerators and ASIC processors.
The Eclipse configuration provides a scalable, field-upgradeable pick-and-place platform for mainstream compute through advanced compute devices, while the EclipseX configuration extends that same architecture to support the higher power, larger form-factor, and thermal demands of AI data center processors – without changing platforms.
One Pick-and-Place Platform for Mobile, Automotive, and High-Performance Compute Test
AI Data Center Ready
Multi-Market Versatility
Advanced Thermal Control
Scalability Across Low to Ultra-High Power Applications Providing Unparalleled Flexibility and Efficiency
Scalable Solution for Testing Standard ICs and Processors
The Eclipse test handler is designed to satisfy high-mix production requirements of test subcontractors, allowing them to leverage their existing device kit infrastructure while utilizing Cohu’s high performance thermal technology for testing mid to high power processors. Featuring Cohu’s proprietary T-Core active thermal controller and a variety of cooling options to provide precise, multi-site temperature management of power dissipative ICs. By enabling higher power dissipation, customers can maximize yield by utilizing Cohu’s T-Core Thermal Controller. With T-Core, customers can manage the most challenging thermal applications from APUs to CPUs to GPUs to server and AI datacenter devices.
The configuration supports a factory automation interface to the handler allowing the customers to interface with a smart factory through the use of autonomous guided vehicles (AGV) or overhead transports (OHT), allowing them to be more efficient. The front-end tray automation provides a new level of performance and capabilities to fuel sales and market position. In production, the fleet’s performance is above the goal set by customers. It boasts more than 28,000 mean cycles between jams (MCBJ) while testing 3×3 millimeter devices.
*device type dependent
Configurable to Dissipate Greater than 3kW of Power
Future-Proof Configurations – One Platform Mobile to HPC
Eclipse
Mobile, Automotive, Industrial, Compute
- Packages: 3 x 3 mm to 110 x 110 mm
- Test force site: up to 650 kgf
- Power dissipation: upgradeable to 6kW T-Core X Active Thermal Control
- Parallelism: X1 to X16
- Passive to Tri-Temp: -40°C to 130°C
EclipseX
Automotive, Compute, AI Datacenter
- Packages: 25 x 25 mm to 135 x 315 mm (full JEDEC tray size)
- Test force site: up to 900 kgf
- Power dissipation: 6kW T-Core X Active Thermal Control
- Parallelism: X1 to X8
- Tri-Temp only: -40°C to 130°C
- Multiple high-capacity chiller options available
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Unique Inspection Options
- Aquilae HR Sidewall: Micro-scale visible defect inspection down to 5 µm
- Aquilae Infrared: Inner cracks detection on silicon devices
- 3D Flex® Vision: True 3D inspection for Balls/Bumps
- ViewMap
Available Options
- Tri-temp -55°C to +155°C (chamber-less, soak on head)*
- Auto Retest
- DTM (Contactor Conditioning)
- DUT Rotation
- Liquid and Mechanical TIM
- Manual RFID
- 207 kgf socket force
- 500 kgf contactor motor force
- Air-Cooled and Water-Cooled Chillers to -70°C
- Thermal (heated) CDP
*for temperatures beyond this range please consult factory
Future-Proof Configurations – Scalable, Cost-Effective Options to Buy Today and Support the Future
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