You are here: Home / Test Handlers / Pick and Place / Eclipse XT
  • Banner

Delta Eclipse XT

Highly Configurable Scalable Pick and Place Handler

Eclipse XT delivers scalable performance for testing a wide range of semiconductors, from analog ICs to high performance mobile processors.  The Eclipse XT is a high speed pick-and-place handler designed to test up to 16 Integrated Circuits (ICs) in parallel, at temperatures from -55°C to +155°C*, with throughput up to 13,000 units per hour.

Featuring Cohu’s  proprietary T-Core thermal controller and a variety of cooling systems in order to provide precise, multi-site temperature management of power dissipative ICs, optimizing test yield of next generation IC’s. It also enables both IDM and Fabless customers to test high-end processors used in augmented virtual reality and deep-learning applications, giving continuity to Cohu’s leadership in advanced thermal test. Eclipse XT offers flexibility for both OSATs, IDM and Fabless customers with its wide market coverage through field configurability.

*device type dependent

Product Sheet
Cohu Delta Eclipse XT Pick and Place Test Handler

  • Key Features

    • Up to 13,000 UPH
    • Parallelism x1 to x16
    • Output bins: 3 auto, 3 manual
    • 3×3 mm to 80×80 mm package handling
    • Passive SLK and device kit compatible with competitors’
    • Chamberless Tri-Temp; No LN2

  • Differentiator

    • Ultra fast T-Core Active Thermal Control
    • 800 W DUT power dissipation (with
      Tri-Temp option)
    • Tight guard band for Start of Test
      (with load board/ socket thermal conditioning option)
    • NIST traceable thermal calibration
    • Configurable SLK x1 to x4 with multiple pitches (Tri-Temp only)
    • Field upgradeable to Ambient/Hot ATC or Tri-Temp ATC (for passive configuration)
    • Force convective and chiller based cooling system – high reliability

  • Available Options

    • Tri-temp -55°C to +155°C (Chamber-less, Soak on Head)*
    • Auto Retest
    • DTM (Contactor Conditioning)
    • DUT Rotation
    • Liquid and Mechanical TIM
    • Manual RFID
    • 207 Kgf Socket Force
    • Vision 2DID, u2DID, OCR
    • In-Socket Vision-based Device Detection
    • Air-Cooled and Water-Cooled Chillers to -70°C
    • Thermal (heated) CDP

    *device type dependent

  • Applications

    • Application Processors (mobile)
    • Automotive Processors
    • CPU and Servers (computing)
    • GPU/AI (graphics)
    • IoT
Contact Sales
Learn More About Our Expertise