NV-Core Inspection System
Deep Learning and Infrared Inspection

Advanced inspection and metrology system providing true infrared imaging for subsurface crack detection on silicon and 3D metrology capability for precision measurements maximizing inspection yield. Artificial Intelligence  algorithms enable pattern recognition and precise defect classification.

Unique Inspection Technology Across Cohu Handlers and Inspection

NV-CoreTM Inspection System is Cohu’s unique inspection technology, enabling advanced inspection capabilities across Cohu’s handler and inspection & metrology portfolio.

NV-Core’s latest advanced inspection technologies include innovative solutions such as 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection for sub-surface defect detection.

In addition to device quality inspection, by mastering the “all-in-one” solution, Cohu can offer unique capabilities for handler’s diagnostics and alignments, that enable the highest productivity performance.

  • 2D and 3D Lead / Pad / Ball / Pin inspections
  • Marking (OCR / OCR), presence and orientation inspections
  • LED lens dome inspection (shape, scratches, bubbles…)
  • Top / bottom / side crack detection
  • Traceability (Bar and Matrix codes)
  • Advanced surface inspection and post sealing quality inspection


6-sided Optical and Infrared Inspection

Inner and Micro-scale Crack Detection

 

Artifical Intelligence Deep Learning

 

Key Features


Aquilae HR Sidewall Module

The Aquilae inspection module combines a high-resolution camera with dedicated image processing algorithms to offer a breakthrough solution for early detection of micro-cracks WLCPs and bumped dies.



Aquilae Infrared Module

Aquilae Infrared Module provides the ability to see through silicon, inspecting the structure underneath the surface; top, bottom, side and in-tape infrared inspection for improved production yield.



3D Flex Vision System

Combining a sequence of touch less 2-dimensional images with projected light patterns to generate high accuracy 3-dimensional measurement of inspected devices.



View Map and Wafer Quality Map

100% single die traceability. Wafer input mapping supervision; wafer mapping and quality map merging, code reader, skeleton check.


Expertise

Learn more about our Inspection and Metrology Solutions