IoT/IoV and Optoelectronics Expertise

Enabling a connected world.

Testing, handling and interface solutions for very small, delicate semiconductors, sensors, and optoelectronic devices.

All Sensor Technologies

LED

Inertial

Low Energy Connectivity

LiDAR

High Performance Microphones

Customer Benefits

UPH

High throughput handling solutions for WLCSPs and standard IC packages.

Optical Test Accuracy

Highest optical test accuracy and yield for the LED market.

Low Force Contacting

Reliable low force contacting products.

RF Test

Unique compact and multisite RF test solution for all connectivity standards.

MEMS and Sensors

Unique architecture to isolate sensors under test from environmental influences, including vibration and noise, enables the handling of delicate devices at very high speeds.

Inspection and Metrology

Unique NV-Core advanced vision with infrared technology to inspect below the silicon surface and metrology tools to distinguish micro-cracks from cosmetic issues.

Test Handlers

Gravity

High Speed Gravity Handler

MT9928 – This well-established test handler provides field proven reliability and performance. Its modular and scalable design and variety of options allow configuration of the MT9928 exactly according to the test needs. Easy-access design and easy-to-change conversion kit parts support fast and easy package style changes. The MT9928 has a large soak capacity and features the entire tri-temp range at outstanding temperature accuracy and stability.

Tube-to-Tube Gravity Handler

Rasco SO1000 – The gravity handler with the largest installed base. Due to mature design and high reliability, it provides excellent cost of test. Highly flexible due to a broad range of device kits that can be combined with various Sensor and MEMS applications.

Gravity Handler for Smallest Package

Rasco SO2000 – Modular designed gravity handler with various input and output possibilities. Additional ambient chamber for dual temp option available. SO2000 can handle the smallest possible packages for Gravity and provides a broad range of Sensor and MEMS applications.

High Parallel Test

High Performance Strip Handler

Jaguar – is designed for high-volume production testing of ICs on a strip format or in device carrier. It is fully automotive qualified for tri-temp test and the ideal solution for high parallel testing of small packages at short test times, but also for Power and Sensor devices. Due to the integrated vision alignment and high precision linear motors, Jaguar provides high yield and excellent OEE.

Loader/Unloader

NY32-LU – is a highly efficient and flexible loading/unloading of InCarrier, including vision inspection and final packaging. Controlled and sensitive device handling with Cohu’s high precision turret and enhanced vision capabilities with NV-Core Inspection System. With our scalable concept, one system could be used as a Loader and Unloader or depending on the desired output, a dedicated Loading or Unloading system can be configured and optimized.

MEMS & Sensors

Modular Design Concept MEMS and Sensor Solutions

We offer innovative concepts for the IoT/IoV and optoelectronics MEMS market; humidity and gas, inertial, microphone, pressure, magnetic and optical sensor test. Cohu MEMS solutions combine the advantages of well-established and production-proven tri-temp test handling equipment with innovative concepts to meet the special requirements of the MEMS market.

Sense+ – next-generation MEMS sensor test platform allows for significant improvement in test accuracy, parallelism for a lower cost of test, and the ability to handle and inspection, small delicate sensors. Fully configured Sense+ delivers a one-pass automated test, inspection, and metrology for the most complex MEMS devices including <1 mm WLCSP.

Pick-and-Place

Configurable OSAT Friendly Pick-and-Place

Delta Eclipse – is part of the key customers’ modular structured smart factory, allowing them to be more efficient. The new front-end tray automation and micron accurate designs provide a new level of performance and capabilities to fuel sales and market position. It boasts more than 42,000 mean contact between jams (MCBJ) and runs 3×3 millimeter devices.

High Parallel Tri-Temp Pick-and-Place

Delta MATRiX – has a highly flexible test site configuration that’s well suited for a wide range of test applications, including analog ICs with short test times and high throughput, automotive devices requiring accurate thermal control, small pitch wireless communication products, high parallel microcontroller testing, MEMS device testing, and many other device market segments with their unique requirements.

Universal Tri-Temp Pick-and-Place

MT9510 XP / MT9510 x16 – is a universal pick and place handler for packages such as QFP, BGA, Micro-BGA, CSP, TSSOP, PLCC, PGA, LGA, MLP/MLF. The MT9510 XP ensures a fully reliable test of packages in cold, hot or ambient test conditions. Based on its outstanding temperature performance, the MT9510 XP provides solutions for managing medium power dissipation in a cost-efficient way.

Turret Test and Scan

Highest Throughput for Fragile Devices

Ismeca NY20 – 20-position turret platform for semiconductors test, inspection and packaging, providing the highest quality yield and throughput. It integrates innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity. The NY20 also integrates with Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with a high-resolution camera.

Highest Demanding Finishing Processes

Ismeca NY32 – 32-position turret platform for semiconductors test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity. The NY32 also integrates Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with a high-resolution camera.

Flexible Test and Scan Solution for FFC Devices

Ismeca NY32W – 32-position turret platform for semiconductors on film-frame wafer media, providing the highest inspection yield. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity. The NY32W also integrates Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

Inspection and Metrology

WLCSP Inspection

Market Leading Inspection Yield with Uncompromised Throughput

Neon – can handle fragile wafer level chip scale products at high speed, maintaining high operational efficiency while inspecting small devices down to 0.4 x 0.2 mm in size. It features extended process integration capabilities and can be configured with infrared and visual micro-scale defect inspection modules. It is also equipped with an external loader unloader to integrate with factory robots for customers adopting Industry 4.0 initiatives.

Package Inspection

Highest Throughput for Fragile Devices

Highest Demanding Finishing Processes

NV-Core Inspection System

Inspection to serve overall machine performance

NV-Core – is Cohu’s unique vision technology, enabling advanced inspection capabilities across Cohu’s handler portfolio. NV-Core latest advance inspection technologies include innovative solution such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection for sub-surface defect detection. In addition to device quality inspection, by mastering the “all-in-one” solution, Cohu can offer unique capabilities for handler’s diagnostics and alignments, that enable the highest productivity performance.

Semiconductor Testers

Application Solutions

Semiconductor Tester Solutions for Internet of Things

Sensors and MEMS
IoT endNodes
Low-cost connectivity

Test Systems

Flexible, Cost Optimized Test Solutions for the Most Challenging Applications

Diamondx – extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost drivers IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.

Market Leading Test System for High Volume RF PA / FEM, 5G and mmWave Devices

PAx – flexible architecture allows configurations of a wide range of instruments that are designed to address the test challenges for RF power amplifiers and front-end modules used in cellular and connectivity applications, including WLAN standards up to Wi-Fi 6, 2G to 5G wireless and beyond, Bluetooth and a variety of IoT standards.

Interface Solutions

Key Test Requirements

Contactor Requirements for Precision Analog and Sensors

Amplifiers, comparators
Line drivers, current sourcing
Power management, voltage references
Sensors
Signal conditioning, PLLs

Spring Probe Contactor/Probe Head

Analog and Mixed Signal Devices

cPython Kelvin Contactor/Probe Head – provides superior electrical and thermal performance with significant cost savings. This makes cPython Kelvin ideal for lab and high-volume production test of analog and mixed signal integrated circuits – for applications such as power control, A-D and D-A converters, audio, video, power amplifiers, photonics, optical MEMS and sensors. cPython Kelvin probes are electrically isolated and mechanically independent force and sense paths for true Kelvin contact for taking accurate measurements, even under high current conditions.

cmWave and mmWave up to 100 GHz

xWave Contactor/Probe Head – utilizes patented hybrid contacting technology to optimize RF performance and provide robustness for production testing of the most challenging cmWave and mmWave devices. Inside the xWave contactor are embedded patch antennas and coplanar waveguides for both wireless and wired communication.

FBGA and Wafer Level Chip Scale Packages

ACE Contactor/Probe Head – offers optimal RF performance for fine pitch FBGA, QFN and wafer-level packages for Power Amplifiers, RF switches and mobile communications. Supporting pitches down to 0.4 mm and superior performance for current consumption, gain, standard deviation, and power efficiency.

High Volume Production Test

cBoa Contactors/Probe Head – the solution for contacting high frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogeneous DUT side plunger provides longer run times between cleaning and increased probe life.

RF and High Speed Digital

cViper Probe Head – ultra-fine-pitch probe head for RF and high speed digital WLCSP and Known-Good-Die applications are ideal for lab and large volume production test of precision analog, RF, sensors and mobility devices.

QuadTech Contacting Solution

Mercury Contactor/Probe Head – excellent spring probes for the laboratory though they were designed with the robust qualities needed for high-volume production test. Their unique design ensures excellent plating quality for low, consistent resistance, long life, and high-test yields.

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Test Handler Solutions

Semiconductor Tester Solutions

Interface Solutions

Inspection and Metrology Solutions

IoT/IoV and Optoelectronics Expertise

Customer Benefits

Test Handlers

High Speed Gravity Handler

Tube-to-Tube Gravity Handler

Gravity Handler for Smallest Package

Inspection and Metrology

Market Leading Inspection Yield with Uncompromised Throughput

Semiconductor Testers

Semiconductor Tester Solutions for Internet of Things

Interface Solutions

Contactor Requirements for Precision Analog and Sensors

Products

Expertise

Sales and Service

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