IoT/IoV and Optoelectronics Expertise

Enabling a connected world

Cohu Advantage

  • Test, handling and interface solutions for very small, delicate semiconductors, sensors and optoelectronic devices
  • High throughput handling solutions for WLCSPs and standard IC packages
  • High volume vision inspection and metrology tools
  • Highest optical test accuracy and yield for LED market
  • Unique compact and multisite RF test solution for all connectivity standards
  • Leading MEMS sensor test platforms with comprehensive portfolio of stimulus modules
  • Reliable low-force contacting products
  • Highest optical test accuracy and yield for LED market

Applications

  • All sensor technologies
  • Lower energy connectivity
  • LED

Test Handler Solutions

Gravity

MT9928

High Speed Gravity Handler

This well-established test handler provides field proven reliability and performance. Its modular and scalable design and variety of options allow configuration of the MT9928 exactly according to the test needs. Easy-access design and easy-to-change conversion kit parts support fast and easy package style changes. The MT9928 has a large soak capacity and features the entire tri-temp range at outstanding temperature accuracy and stability.

Rasco SO1000

Tube-to-Tube Gravity Handler

The gravity handler with the largest installed base. Due to mature design and high reliability it provides excellent cost of test.  Highly flexible due to a broad range of device kits that can be combined with various Sensor and MEMS applications.

Rasco SO2000

Gravity Handler for Smallest Package

Modular designed gravity handler with various input and output possibilities. Additional ambient chamber for dual temp option available. SO2000 can handle smallest possible packages for Gravity and provides a broad range of Sensor and MEMS applications.

High Parallel Test

PANTHER Power

All-in-One Test and Inspection System for small package ICs

PANTHER Power enables higher production yield with integrated test and inspection cell with high parallel tri temp testing for small leadless packages, QFN / DFN .

It uses a chamber-less thermal technology, with six soaking stations. Coupled to a Cohu thermo pre-conditioned contactor, it guarantees a high stability in temperature at full range, from -45 °C to +155 °C.

PANTHER Power offers the most reliable testing cell for small devices at high speed with unlimited test parallelism.

PANTHER WLCSP

High Performance Post Singulated Test

PANTHER WLCSP is a breakthrough technology in post singulation testing. It provides the lowest cost of test for high volume QA and or customer return testing for singulated WLCSP, under real probing condition with direct docking at high parallelism and with 100% touch down efficiency.

PANTHER WLCSP guarantees 100% output quality with post singulation test and inspection with micro scale defect detection.

Rasco Jaguar

High Performance Strip Handler

Jaguar is designed for high-volume production testing of ICs on a strip format or in device carrier. It is fully automotive qualified for tri-temperature test and the ideal solution for high parallel testing of small packages at short test times, but also for Power and Sensor devices. Due to the integrated vision alignment and high precision linear motors, Jaguar provides high yield and excellent OEE.


Pick and Place

Delta Eclipse XTA

Final Test System Lights Out Factory

The Eclipse XTA combines the essence of the Eclipse XT platform with Industry 4.0 factory automation—the current trend in automation and data exchange in manufacturing technologies. The Eclipse XTA is part of the key customers’ modular structured smart factory, allowing them to be more efficient. The new front-end tray automation and micron accurate designs provide a new level of performance and capabilities to fuel sales and market position. In production, the XTA fleet’s performance is above the goal set by customers. It boasts more than 42,000 mean contact between jams (MCBJ) and runs 3×3 millimeter devices.

Delta MATRiX

High-Performance, Configurable Pick and Place Handler

The MATRiX handler has a highly-flexible test site configuration that’s well suited for a wide range of test applications, including analog ICs with short test times and high throughput, automotive devices requiring accurate thermal control, small pitch wireless communication products, high parallel microcontroller testing, MEMS device testing, and many other device market segments with their unique requirements. The MATRiX has a highly flexible test site configuration that enables customers to reuse existing load-boards, including boards made for competitor’s legacy handlers.

MT9510

Tri-Temp Pick and Place Handler

The MT9510 XP / MT9510 x16 is a universal pick and place handler for packages such as QFP, BGA, Micro-BGA, CSP, TSSOP, PLCC, PGA, LGA, MLP/MLF.

The MT9510 XP ensure fully reliable test of packages in cold, hot or ambient test conditions. Based on its outstanding temperature performance, the MT9510 XP provides solutions for managing medium power dissipation in a cost-efficient way.

The MT9510 x16 continues the MT9510 XP features in terms of reliability, temperature performance and advanced options.

Sensors and MEMS Test

Modular design based on standard handlers, high parallelism, ambient to automotive tri-temp handling

Cohu MEMS solutions combine the advantages of well established and production proven tri-temp test handling equipment with innovative concepts to meet the special requirements of the MEMS market.

The modular design concept allows greatest flexibility for our customers as it allows ease of conversion between stimulus types. This flexibility and modularity provides the customers with the advantage of being able to react fast to the market changes and provides the best return on investment.

Cohu MEMS modules are available for a variety of sensor test applications, for singulated devices in various input media and also the unique and cost-efficient strip test in carriers, allowing the highest test parallelism in the market, and thus reducing the customers cost of test.

Turret Test and Scan

Ismeca NY20

Highest Throughput for Fragile Devices

20-position turret platform for semiconductors test, inspection and packaging, providing the highest quality yield and throughput. It integrates innovative hardware and software technology such as Intelligent Features that enable extended autonomous operation and productivity.

The NY20 also integrates with Cohu’s latest Advance Inspection technologies such as, 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with high resolution camera.

Ismeca NY32

Highest Demanding Finishing Processes

32-position turret platform for semiconductors test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as Intelligent Features that enables extended autonomous operation and productivity.

The NY32 also integrates Cohu’s latest Advance Inspection technologies such as, 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with high resolution camera.

Ismeca NY32W

Highest Inspection Yield for Wafer Level Packages and Bare Dies

32-position turret platform for semiconductors on film-frame wafer media, providing highest inspection yield. Integrating innovative hardware and software technologies such as Intelligent Features that enables extended autonomous operation and productivity.

The NY32W also integrates Cohu’s latest Advanced Inspection technologies such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

Inspection Solutions

WLCSP Inspection

Neon

Market Leading Inspection Yield with Uncompromised Throughput

Neon is Cohu’s next generation inspection platform optimized for small, fragile semiconductors used in mobility and consumer applications.

Neon can handle fragile wafer level chip scale products at high speed, maintaining high operational efficiency while inspecting small devices down to 0.4 x 0.2 mm in size. It features extended process integration capabilities and can be configured with infrared and visual micro-scale defect inspection modules. It is also equipped with an external loader unloader to integrate with factory robots for customers adopting Industry 4.0 initiatives.

Neon  is designed to provide our customers with the best price/performance ratio in the industry, targeting semiconductors used in handset and small consumer electronics applications for high volume die sort needs.

Ismeca NY32W

Highest Inspection Yield for Wafer Level Packages and Bare Dies

32-position turret platform for semiconductors on film-frame wafer media, providing highest inspection yield. Integrating innovative hardware and software technologies such as Intelligent Features that enables extended autonomous operation and productivity. The NY32W also integrates Cohu’s latest Advanced Inspection technologies such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

NVcore Vision System

NVcore

Inspection to serve overall machine performance

NVcore is Cohu’s unique vision technology, enabling Advanced Inspection capabilities across Cohu’s handler portfolio.

NVcore latest Advance Inspection technologies include innovative solution such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection for sub-surface defect detection.

In addition to device quality inspection, by mastering the “all-in-one” solution, Cohu can offer unique capabilities for handler’s diagnostics and alignments, that enable the highest productivity performance.

Semiconductor ATE Solutions

Test Systems

Diamondx

Flexible, Cost Optimized Test Solutions for the Most Challenging Applications

Diamondx test system extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost driver’s IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.

Breakthrough cost reductions in both capital and operating costs for the automotive, mobility, IoT/IoV/Optoelectronics, industrial and medical, and consumer markets.

Proven capability in high-density digital, DC, analog instruments as well as technology leading precision analog, SerDes, RF and Automotive test makes the Diamondx test system suitable for today’s broad range of devices.

PAx

Market Leading Test System for High Volume RF PA & FEM, 5G and Mobility Devices

PAx’s flexible architecture allows configurations of a wide range of instruments that are designed to address the test challenges for RF power amplifiers and front-end modules used in cellular and connectivity applications, including WLAN standards up to Wi-Fi 6, 2G to 5G wireless and beyond, Bluetooth and a variety of IoT standards. Many of these new generation wireless devices require ever more demanding RF test capabilities from test instruments, such as wider bandwidths and lower EVM, and PAx’s configurable architecture delivers the optimized test solution with superior RF performance at a uncompromised cost of test.

Instrumentation

Cohu has a number of ATE instruments to address the IoT markets

Test Contactor / Probe Head Solutions

ACE Contactor / Probe Head

RF (cmWave) probe with bandwidth up to 40GHz, Homogeneous tip, and long life

ACE test contactor offers optimal RF performance for fine pitch FBGA, QFN and wafer-level packages for Power Amplifiers, RF switches and mobile communications. Supporting pitches down to 0.4 mm and superior performance for current consumption, gain, standard deviation, and power efficiency.

ACE probe head provides exceptional electrical performance, both DC and RF and is manufactured from HyperCore™ base material, which is a proprietary material of Cohu’s Everett Charles Technologies.

Compatible with all device types, platings, and pitches; and all test applications, including singulated devices, strip test and wafer-scale test. The materials and architecture create a very robust probe with a very working life and best yield. The electrical and mechanical performance, combined with the long probe life, deliver low overall cost of test, which are unprecedented for RF contactors.

cBoa Contactor / Probe Head

Uncompromised performance radial probe for the toughest test conditions

cBoa contactors and probe heads are the solution for contacting high frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogenous DUT side plunger provides longer run times between cleaning and increased probe life.

The cBoa features a stainless-steel spring for tri-temp testing and performs in operating temperatures of -55°C to +155°C. With a bandwidth up to 27 GHz, cBoa can be used to test some of the highest frequency devices.

The enhanced compliance window accommodates package stack height tolerances well.

cDragon Contactor

Excellent RF performance and reliability for tri-temp production test with low cost of ownership

cDragon pin’s thermal design supports fast temperature control response and stabilization for repeatable at temperature testing of devices in a handler environment.

By design the cDragon’s pin decouples insertion motion from the test-interface-board side of the pin. This eliminates test-interface-board pad wear.

cDragon’s low profile and high bandwidth with low inductance makes it an ideal contacting solution for testing of mobile communications, RF switches, A/D converters, LNA’s, and PMIC devices. cDragon’s pins affinity to solder migration will ensure low and repeatable contact resistance.

cDragon can be used for testing any perimeter pad devices (QFN, DFN) and leaded packages (QFP, SO).

cPython Kelvin Contactor / Probe Head

High performance kelvin contact for high volume production test

cPython Kelvin contactors and probeheads provide superior electrical and thermal performance with significant cost savings.  This makes cPython Kelvin ideal for lab and high-volume production test of analog and mixed signal integrated circuits – for applications such as power control, A-D and D-A converters, audio, video, power amplifiers, photonics, optical MEMS and sensors.

cPython Kelvin probes are electrically isolated and mechanically independent force and sense paths for true Kelvin contact for taking accurate measurements, even under high current conditions. These robust probes provide hundreds of thousands of insertions or touchdowns, and a bandwidth up to 26GHz.  cPython Kelvin probes can land on 0.4 mm pitch targets, and their tip spacing is 90 µm to land on small targets. cPython probes are available with homogeneous tips to optimize performance.

cViper Contactor / Probe Head

Radial wafer probe solution down to 100 µm pitch with low loop inductance and high bandwidth and optional manual actuator for testing singulated die

cViper ultra-fine-pitch probe heads for RF and high speed digital WLCSP and Known-Good-Die applications are ideal for lab and large volume production test of precision analog, RF, sensors and mobility devices. With low loop inductance, bandwidth up to 25 GHz, and low and stable contact resistance, cViper is an ideal choice for thorough testing of WLCSP and bumped die for MCM and COB applications. cViper probes are available in 100, 150, and 200 µm  minimum pitch and are manufactures with variety of contact materials to optimize performance.

Mercury Contactor / Probe Head

Industry preferred high performance, high value, low cost QuadTech contacting solution

Mercury probes and contactors are excellent spring probes for the laboratory though they were designed with the robust qualities needed for high-volume production test. Their unique design ensures excellent plating quality for low, consistent resistance, long life, and high-test yields. Mercury probes are available with minimum pitches of 0.3 mm, 0.4 mm, 0.5 mm, and 0.8 mm, to provide the best performance at any device pitch. Mercury probes have bandwidths of up to 22 GHz, and can carry over 3 Amps of current. The Mercury is an excellent choice for any test application.

RF Scrub Contactor

Excellent RF performance with low cost of ownership

Extremely short signal path rugged probe with high wear resistance for SO, DFN, and QFN packages.

RF Scrub Contactor’s innovative design combines an extremely short signal path (0.90mm test height) with high wear resistance pins that can operate in a wide temperature range (-40ºC to +150ºC).

The RF Scrub contactor’s long-life, elastomer free design and easy field maintainability makes it an optimal solution for testing of high-performance devices.

The RF Scrub design minimizes load board wear and with the unique pin base material and plating, the cleaning intervals can last up to 100,000 cycles.

The RF Scrub contactor is adaptable to multiple packages (QFN/DFN/MLF, QFP, SO, SOT, TO) and handler platforms making it an ideal low-cost solution for your RF and acoustic applications.

xWave Contactor / Probe Head

Highest performance and most robust RF broadband production solution for package, wafer, or OTA test to 100 GHz

The xWave contactor utilizes patented hybrid contacting technology to optimize RF performance and provide robustness for production testing of the most challenging cmWave and mmWave devices. Inside the xWave contactor are embedded patch antennas and coplanar waveguides for both wireless and wired communication.

In addition to wireless communication xWave contactors minimize the number of transitions between the DUT and tester through the use of co-planar waveguide structures that make direct connection with the DUT, bypass the PCB, and connect to the tester with either coaxial cable or waveguides.

Test Cell Solutions

MEMS Test Cell

Pre-validated Test Cells delivering fast ramp to production yield and throughput

Cohu is the only company with the expertise on the entire test cell and inspection and is recognized for its industry-leading suite of flexible and cost-effective MEMS test cell offerings. We work in close cooperation with our customers and leverage the cross functional expertise of Cohu’s product teams; semiconductor ATE, test handler and interface solutions.

Cohu provides a full pre-validated service within our facilities, to ensure that start up time at the customer site is minimized and target production yield and throughput are achieved in the fastest possible time.

Cohu has delivered more than 20 complete MEMS test cells to IDMs and OSATs in Asia, Europe and North America to address next-generation device test requirements and supplement existing production capacity.