PAICe Digital Twin Platform
From Data to Insights – 10x Faster
Accelerate Time to Insight
PAICe Digital Twin Platform™ is the high-performance, AI-driven data platform for semiconductor manufacturers that accelerates every step of analytics and application delivery. Our patented compression techniques provide up to 5x faster data access, 10x faster visualization of live and historical datasets, and rapid app development in days – not months. By combining automated feature extraction with low-code AI tools, PAICe eliminates coding bottlenecks and fragmented data, giving teams real-time insights and the agility to innovate at speed – on an enterprise-ready, re-engineered digital twin data fabric.
PAICe compresses time across data access, analytics, and app delivery.
Time-To-Value, and Cycle-Time Reduction.
Automated feature extraction + low-code AI remove coding bottlenecks.
Teams build, validate, and deploy analytics without long data-science or IT queues; natural-language/Digital Twin Query Language (DTQL®) -style workflows.
Act Without Waiting for Specialists.
A high-performance platform purpose-built for semiconductor data (traces, alarms and logs, MES/CMMS, metrology/inspection, test) in real time.
Tool-agnostic ingestion; streaming + historical context; one place to query, visualize, and operationalize insights.
Eliminates Fragmented Systems and ‘Where is the Data’ Delays.
From idea to functioning workflow UI in days, enabling measurable business improvements.
PAICe RapidApps™ purpose-built applications for non-power users (beyond dashboards); faster troubleshooting, yield ramp, OEE gains.
Faster KPI Improvement, Not Just Faster Charts.
Move beyond predictive to prescriptive and closed-loop control – with real-time expert-guided insights that recommend and enact next best actions.
Anomaly detection, guided repair recommendations, adaptive process control; fewer excursions, faster MTTR.
Get Action – Not Just Alerts.
On-prem/hybrid, secure integration to shop-floor interfaces and existing factory systems
Industry communication standards: OPC/PLC/Modbus, SECS/GEM/IF-A connectivity; exports to common formats; governance and role-based access.
Fit-for-Factory Readiness.
PAICe Software Solutions
Boost yield, optimize equipment performance, and enable smart automation across the fab ecosystem
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