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SO Package Interface Solutions

Challenges and Solutions for Contacting Small Outline Devices

SO packages are leadframe-based and usually encapsulated in a rectangular plastic body with leads extending out two sides. For better electrical and thermal performance many SO packages have an exposed ground pad on the underside. SO packages are sized according to industry standards and have lead pitches ranging from 0.35 mm to 1.27 mm.

SO Package Test Solutions

Test Contactor / Probe Head Solutions

cBoa Contactor / Probe Head

Uncompromised performance radial probe for the toughest test conditions

cBoa contactors and probe heads are the solution for contacting high frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogenous DUT side plunger provides longer run times between cleaning and increased probe life.

The cBoa features a stainless-steel spring for tri-temp testing and performs in operating temperatures of -55°C to +155°C. With a bandwidth up to 27 GHz, cBoa can be used to test some of the highest frequency devices.

The enhanced compliance window accommodates package stack height tolerances well.

cDragon Contactor

Excellent RF performance and reliability for tri-temp production test with low cost of Ownership

cDragon pin’s thermal design supports fast temperature control response and stabilization for repeatable at temperature testing of devices in a handler environment.

By design the cDragon’s pin decouples insertion motion from the test-interface-board side of the pin. This eliminates test-interface-board pad wear.

cDragon’s low profile and high bandwidth with low inductance makes it an ideal contacting solution for testing of mobile communications, RF switches, A/D converters, LNA’s, and PMIC devices. cDragon’s pins affinity to solder migration will ensure low and repeatable contact resistance.

cDragon can be used for testing any perimeter pad devices (QFN, DFN) and leaded packages (QFP, SO).

cHybrid Turret Kelvin Contactor

For leaded and leadless devices down to 0.3 mm x 0.6 mm

Compact multi-beam pin structure for high density system integration on turret handlers with side-by-side design for very small pad sizes.,

cHybrid Kelvin contactor contains a new and unique contact spring architecture which allows the test socket to adapt to challenging IC pad geometry requirements of todays and future small package types. Great lifetime up to 3 million touchdowns, with best-in-class contact resistance repeatability reduces cost of test significantly. A multibeam contact structure optimizes signal integrity and current capability according to challenging electrical test requirements.

cHybrid Kelvin contactor with multibeam contact spring architecture delivers improved yield and long life which minimizing cleaning cycles. This innovative solution will help customers reduce cost and maximize productivity.

cPython Kelvin Contactor / Probe Head

High performance kelvin contact for high volume production test

cPython Kelvin contactors and probe heads provide superior electrical and thermal performance with significant cost savings. This makes cPython Kelvin ideal for lab and high-volume production test of analog and mixed signal integrated circuits – for applications such as audio, video, power amplifiers, photonics, optical MEMS and sensors.

cPython Kelvin features electrically isolated and mechanically independent force and sense paths, making the voltage drop negligible. This provides low and stable contact resistance with bandwidth up to 26 GHz.

cPython Kelvin has an optional manual actuator for testing singulated devices and can be designed with a pitch down to .3mm pitch, tip to tip spacing as low as 70 µm. cPython Kelvin is available in a variety of contact materials to optimize performance.

ecoAmp Kelvin Contactor

Cantilever contactor for high power applications

ecoAmp Kelvin is a high power cantilever kelvin contactor with patented spring and tip design for optimum heat dissipation. This ensures best reliability, long spring life and high yield even under highest current and temperature requirements.

Gemini Kelvin Contactor / Probe Head

Industry preferred high performance, high value, low cost true kelvin QuadTech contacting solution

Gemini Kelvin probes and contactors provide a first-rate solution that effortlessly makes reliable, true Kelvin contact for high-volume final test of both singulated packages and wafer-level devices. Gemini Kelvin is an ideal solution for devices such as power controllers, A-D and D-A converters, power amplifiers and audio and video circuits.

At 3.22 mm test height, the Gemini Kelvin is an excellent all-around spring probe with low inductance, high bandwidth, and excellent current-carrying capacity. The DUT side tip design accurately maintains its 100 µm spacing for the life of the probe. Customers report typical probe life of 500 k to 800 k package insertions, or over 2M touchdowns at wafer-level test. The offset tip allows manageable board layout with a board-side spacing of 0.4 mm.

Mercury Contactor / Probe Head

Industry preferred high performance, high value, low cost QuadTech contacting solution

Mercury probes and contactors are excellent spring probes for the laboratory though they were designed with the robust qualities needed for high-volume production test. Their unique design ensures excellent plating quality for low, consistent resistance, long life, and high-test yields. Mercury probes are available with minimum pitches of 0.3 mm, 0.4 mm, 0.5 mm, and 0.8 mm, to provide the best performance at any device pitch. Mercury probes have bandwidths of up to 22 GHz, and can carry over 3 Amps of current. The Mercury is an excellent choice for any test application.

MiCon Contactor

Proven cantilever technology for MCUs and ASICs

MiCon is spring pin footprint compatible supporting advanced temperature requirements as well as advanced power/current requirements. The footprint compatibility allows for easy and cost-efficient conversion from spring pin setups. The fully decoupled load board side of the spring ensure no degradation of the load board pad.

MiCon features a single piece design, which ensures a long lifespan, low and stable contact resistance, high current carrying capability and an extended temperature range. The MiCon allows for testing at full specification values. The extended operating range accommodates device lead trim and form variability such as device alignment accuracy and device lead coplanarity.

nanoKelvin Contactor

Kelvin test socket for high power plung-to-board applications

nanoKelvin is a well-established cantilever kelvin contactor with proven performance in the automotive market and further increasing popularity due to the robustness and reliability of the product.

RF Scrub Contactor

Excellent RF performance with low cost of ownership

Extremely short signal path rugged probe with high wear resistance for SO, DFN, and QFN packages.

RF Scrub Contactor’s innovative design combines an extremely short signal path (0.90mm test height) with high wear resistance pins that can operate in a wide temperature range (-40ºC to +150ºC).

The RF Scrub contactor’s long-life, elastomer free design and easy field maintainability makes it an optimal solution for testing of high-performance devices.

The RF Scrub design minimizes load board wear and with the unique pin base material and plating, the cleaning intervals can last up to 100,000 cycles.

The RF Scrub contactor is adaptable to multiple packages (QFN/DFN/MLF, QFP, SO, SOT, TO) and handler platforms making it an ideal low-cost solution for your RF and acoustic applications.

  • Contacting Challenges

    • High currents
    • Co-planarity issues
    • Lead geometry issues including bent leads
    • Kelvin test requirements
    • Lead oxidation
    • Tin migration
    • Wear due to NiPd plating
    • Ground pad contacting requirements
  • Contactor Features

    • Choice of platings or homogeneous material
    • Large targets for device leads
    • High contact force
    • Low and stable contact resistance
    • Significant compliance for tolerance stack-up
    • High current carrying capacity
    • Sharp contact points or scrubbing action for piercing oxides
    • Ground pad contacting with probes or ground block
  • Package Features

    • Wide variety of pitches, sizes and lead counts
    • Wide range of applications
    • Relatively low-cost package
    • Exposed ground pads for electrical and thermal performance
    • Typically plated with Sn or NiPd
    • Can be contacted in strip form
    • Can handle high currents