PAICe Digital Twin Platform

From Data to Insights – 10x Faster

Accelerate Time to Insight

The High-Performance, AI-Driven Digital Twin Platform for Semiconductor Manufacturers

PAICe Digital Twin Platform™ is the high-performance, AI-driven data platform for semiconductor manufacturers that accelerates every step of your analytics and application delivery. Our patented compression techniques provide up to 5x faster data access, 10x faster visualization of live and historical datasets, and rapid app development in days – not months. By combining automated feature extraction with low-code AI tools, PAICe eliminates coding bottlenecks and fragmented data, giving teams real-time insights and the agility to innovate at speed – on an enterprise-ready, re-engineered digital twin data fabric.

5x Faster Data Access

10x Faster Visualization

Hourglass Hourglass

Customized Apps 10x Faster

Customer Benefits


Gauge Gauge

Accelerate Everything

PAICe compresses time across data access, analytics, and app delivery.

  • Up to 5x faster data access
  • 10x faster visualization
  • Rapid application delivery in days, not months

Time-To-Value, and Cycle-Time Reduction.



Democratizes AI and Low-Code

Automated feature extraction + low-code AI removes coding bottlenecks.

Teams build, validate, and deploy analytics without long data-science or IT queues; natural-language/Digital Twin Query Language (DTQL®) -style workflows.

Act Without Waiting for Specialists.



Unified Digital Twin Data Fabric

A high-performance platform purpose-built for semiconductor data (traces, alarms and logs, MES/CMMS, metrology/inspection, test) in real time.

Tool-agnostic ingestion; streaming + historical context; one place to query, visualize, and operationalize insights.

Eliminates Fragmented Systems and ‘Where is the Data’ Delays.



AI-Generated RapidApps Deliver Outcomes

From idea to functioning workflow UI in days, enabling measurable business improvements.

PAICe RapidApps™ purpose-built applications for non-power users (beyond dashboards); faster troubleshooting, yield ramp, OEE gains.

Faster KPI Improvement, Not Just Faster Charts.



Instant Insight-to-Action

Move beyond predictive to prescriptive and closed-loop control – with real-time expert-guided insights that recommend and enact next best actions.

Anomaly detection, guided repair recommendations, adaptive process control; fewer excursions, faster MTTR.

Get Action – Not Just Alerts.



Fast-Start Integration

On-prem/hybrid, secure integration to shop-floor interfaces and existing factory systems

Industry communication standards: OPC/PLC/Modbus, SECS/GEM/IF-A connectivity; exports to common formats; governance and role-based access.

Fit-for-Factory Readiness.


PAICe Software Solutions

Cohu Equipment Back-end Test Semiconductor IDM, Fabless and OSAT

Uses equipment expertise and AI/ML to turn Cohu’s equipment data into actionable insights with guided repair recommendations​.

Software uses deep learning and pattern recognition to boost inspection yield, cut overhead, and enhance manufacturing efficiency. ​


Semiconductor Front-end, Back-end, and OEMs (Equipment Agnostic)

Quickly ingest and store raw trace and tool data, extract insights, and deploy predictive analytics for your process.

AI-driven advanced process control for manufacturing that automatically adapts to process drifts over time. Closed-loop AI software controller.

Measurable Impact at Speed

Boost yield, optimize equipment performance, and enable smart automation across the fab ecosystem