Cohu has a leading position with thermal handlers and interface solutions controlling the temperature of GPU and high-end CPU devices under test; 100 G/400 G data communications and processing network infrastructure.
High force pick-and-place handling solutions for large IC packages.
Unique T-Core Active Thermal Control (ATC) technology enables the testing of very high-power processors.
Coaxial solutions providing exceptional signal isolation and impedance control, scalable for large package platforms up to 60 Gbps.
Solutions and expertise for Hard Disk Drive ICs.
Leading provider of Industry 4.0 ready solutions for semiconductor test and inspection & metrology.
Unique NV-Core advanced vision with infrared technology to inspect below the silicon surface and metrology tools to distinguish micro-cracks from cosmetic issues.
MT9928 – This well-established test handler provides field-proven reliability and performance. Its modular and scalable design and variety of options allow configuration of the MT9928 exactly according to the test needs. Easy-access design and easy-to-change conversion kit parts support fast and easy package style changes. The MT9928 has a large soak capacity and features the entire tri-temp range at outstanding temperature accuracy and stability.
MCT MH-3300 – designed for marketing of 2DiD codes on the lead frame in support of strip testing, marking of reject devices, and final package marketing in strip test or assembly operations.
MCT FH-1200 – designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages.
Modular Design Concept MEMS and Sensor Solutions
We offer innovative concepts for the automotive MEMS market; magnetic, inertial, pressure, microphone, optical, humidity and gas sensor test. Cohu MEMS solutions combine the advantages of well-established and production-proven tri-temp test handling equipment with innovative concepts to meet the special requirements of the MEMS market.
Sense+ – next-generation MEMS sensor test platform allows for significant improvement in test accuracy, parallelism for a lower cost of test, and the ability to handle and inspection, small delicate sensors. Fully configured Sense+ delivers a one-pass automated test, inspection, and metrology for the most complex MEMS devices including <1 mm WLCSP.
Configurable OSAT Friendly Pick-and-Place
Delta Eclipse – is part of the key customers’ modular structured smart factory, allowing them to be more efficient. The new front-end tray automation and micron accurate designs provide a new level of performance and capabilities to fuel sales and market position. In production, the XTA fleet’s performance is above the goal set by customers. It boasts more than 42,000 mean contact between jams (MCBJ) and runs 3×3 millimeter devices.
Inspection and Metrology
NV-Core – is Cohu’s unique vision technology, enabling advanced inspection capabilities across Cohu’s handler portfolio. NV-Core latest advance inspection technologies include innovative solution such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection for sub-surface defect detection. In addition to device quality inspection, by mastering the “all-in-one” solution, Cohu can offer unique capabilities for handler’s diagnostics and alignments, that enable the highest productivity performance.
Diamondx – test system extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost drivers IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.
Semiconductor tester instruments for Networking and Computing
A variety of instruments make the Diamondx suitable for testing todays Wireless, Mobility, SOC, Flat Panel Display drivers, Power Management, and Microcontrollers for the Automotive, Mobility, IoT/IoV/Optoelectronics, Data Center, Cloud and AI, Industrial and Medical, and Consumer markets.
Contactor Requirements for High End Digital
- High compliance (>0.4 mm)
- Low force (>20 g)
- Low contact resistance (>50 mΩ)
- High current (150 A)
MiCon Cantilever Contactor – spring pin footprint compatible supporting advanced temperature requirements as well as advanced power/current requirements. The footprint compatibility allows for easy and cost-efficient conversion from spring pin setups.
cPython Kelvin Contactor/Probe Head – provides superior electrical and thermal performance with significant cost savings. This makes cPython Kelvin ideal for lab and high-volume production test of analog and mixed signal integrated circuits – for applications such as power control, A-D and D-A converters, audio, video, power amplifiers, photonics, optical MEMS and sensors. cPython Kelvin probes are electrically isolated and mechanically independent force and sense paths for true Kelvin contact for taking accurate measurements, even under high current conditions.
xWave Contactor/Probe Head – utilizes patented hybrid contacting technology to optimize RF performance and provide robustness for production testing of the most challenging cmWave and mmWave devices. Inside the xWave contactor are embedded patch antennas and coplanar waveguides for both wireless and wired communication.
ICON Coaxial Contactor – designed specifically for maintaining the native impedance of the device-under-test (DUT) through the contactor to the test system, maximizing high frequency power transfer by minimizing signal reflections (Return Loss).
Atlas Contactor/Probe Head – offers electrical performance that allows the customer to test to the true performance of the device. Atlas WLCSP test contactors achieve mechanical reliability with a rigid “cruciform” tip applied to Cohu’s QuadTech flat probe technology. The Atlas offers a short electrical path, with lower capacitance and inductance, that is ideal for functional and AC parametric testing of WLCSP devices that require high system bandwidth and throughput gains in large multisite test applications.
cBoa Contactors/Probe Head – the solution for contacting high frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogeneous DUT side plunger provides longer run times between cleaning and increased probe life.
Mercury Contactor and Probe Heads – excellent spring probes for the laboratory though they were designed with the robust qualities needed for high-volume production test. Their unique design ensures excellent plating quality for low, consistent resistance, long life, and high-test yields.
ACE Contactor/Probe Head – offers optimal RF performance for fine pitch FBGA, QFN and wafer-level packages for Power Amplifiers, RF switches and mobile communications. Supporting pitches down to 0.4 mm and superior performance for current consumption, gain, standard deviation, and power efficiency.