Cost-Efficient, High-Performance Contactor or Probe Head for High-Volume Production Test
Ability to Test some of the Highest Frequency Devices
cBoa test contactors and probe heads are the solutions for contacting high-frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogeneous DUT side plunger provides longer run times between cleaning and increased probe life.
The cBoa features a stainless-steel spring for tri-temp testing and performs in operating temperatures of -55°C to +155°C and bandwidth of up to 35 GHz @ -1 dB.
The enhanced compliance window accommodates package stack height tolerances well. The cBoa provides optimal contact for all package types and accommodates package planarity tolerances.
Key Features
Temperature
Temperature range -55 ̊C to +155 ̊C.
Packages
BGA, LGA, SO, QFN, QFP, and WLCSP. Singulated packages, strip test and wafer-level chip scale test.
Low Loop Inductance and High Bandwidth
High signal integrity and power delivery for RF devices.
Floating Alignment Plate
Floating alignment plate provides higher continuity yield.
Electrical Current
Current carrying capacity up to 3.1 A continuous.
Variety of Contact Materials
Optimizing performance through resistance stability and longer usable life.
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Expertise
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