Ability to Test some of the Highest Frequency Devices
cBoa test contactors and probe heads are the solutions for contacting high-frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogeneous DUT side plunger provides longer run times between cleaning and increased probe life.
The cBoa features a stainless-steel spring for tri-temp testing and performs in operating temperatures of -55°C to +155°C and bandwidth of up to 35 GHz @ -1 dB.
The enhanced compliance window accommodates package stack height tolerances well. The cBoa provides optimal contact for all package types and accommodates package planarity tolerances.
Temperature range -55 ̊C to +155 ̊C.
BGA, LGA, SO, QFN, QFP, and WLCSP. Singulated packages, strip test and wafer-level chip scale test.
High signal integrity and power delivery for RF devices.
Floating alignment plate provides higher continuity yield.
Current carrying capacity up to 3.1 A continuous.
Optimizing performance through resistance stability and longer usable life.
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