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cBoa™ Test Contactor (Socket) / Probe Head (Pins)

Cost-Effective, High-Performance Contactor or Probe Head for High-Volume Production Test

cBoa test contactors (sockets) and probe heads (pins) are the solution for contacting high frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe (pins) withstand the rigors of high-volume test by providing longer life and higher yield. The homogenous DUT side plunger provides longer run times between cleaning and  increased probe life.

The cBoa features a stainless-steel spring for tri-temp testing and performs in operating temperatures of -55°C to +155°C. With a bandwidth up to 27 GHz, cBoa can be used to test some of the highest frequency devices.

The enhanced compliance window accommodates package stack height tolerances well.

Product Sheet
cBoa-Contactor

  • Key Features

    • Variety of contact materials to optimize performance
    • WLCSP, BGA, LGA, QFN, QFP
    • Low loop inductance and high bandwidth
    • Pitches down to 300 µm
    • Optional floating alignment plate
    • Large compliance window
    • Excellent current carrying capacity

  • Benefits

    • Excellent resistance stability and prolonged usable life
    • Optimal contact for all package types
    • High signal integrity and power delivery for RF devices
    • Suitable for singulated packages, strip or wafer-level test
    • Optimal DUT alignment
    • Accommodating package planarity tolerances
    • Excellent contact choice for all device types

  • Package Type

    • BGA
    • LGA
    • SO
    • QFN
    • QFP
    • WLCSP
    • Singulated packages, strip test and wafer level test
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