Package Inspection

High throughput inspection system with multi processes and media for advanced packages

Cohu offers a wide range of solutions for inspection and packaging of singulated molded leaded and leadless devices.

Our Turret handlers with NVcore vision inspection technology allow for a highly versatile process configuration that answer to the most advanced test handling and inspection requirements.

Ismeca NY20

Highest Throughput for Fragile Devices

The 20-position turret platform for semiconductors test, inspection and packaging, providing the highest quality yield and throughput.

Ismeca NY32

Highest Demanding Finishing Processes
The 32-position turret platform for semiconductor test, inspection and packaging, providing the highest process integration capabilities.