NY32™ turret test platform for test and inspection of high performance mixed signal, high frequency and sensor devices.
Highest Demanding Finishing Processes
The NY32 is a 32-position turret platform for semiconductor test, inspection and packaging, provides the highest process integration capabilities. Integrating innovative hardware and software technology such as intelligent features enables extended autonomous operation and productivity.
The NY32 also integrates Cohu’s NV-Core advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with a high-resolution camera.
Featuring Cohu’s PAICe Digital Twin Platform providing real-time equipment monitoring and data analytics for Industry 4.0/Factory Automation.
This platform is well suited for RF devices, small power management ICs, solid state lighting devices and many other ICs. These devices are commonly used in mobile products, “Internet of Things” applications and increasingly in automotive infotainment systems.
Available Options
- Tray Input or Output
- Laser Marking Integration
- High Resolution Camera
- LED / Laser LED Testing (full flux or intensity)
- LED Sorter up to x64 Bins
Inspection Options
- Aquilae HR Sidewall: Micro-scale visible defect inspection down to 5 µm
- Aquilae Infrared: Inner cracks detection on silicon devices
- 3D Flex® Vision: True 3D inspection for Balls/Bumps
- Unique Twin Wafer and ViewMap to increase throughput
Software Analytics Options
- Real-time equipment monitoring and management
- Preventative Maintenance
- Central Recipe Management
- Knowledge Database and Unified Reports
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Expertise
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