Guaranteed advanced quality inspection with lowest rejection, with uncompromised throughput, across an entire equipment fleet
Cohu offers a wide range of solutions for the Inspection and Packaging of Post-singulated Wafer Level Chip Scale Packages (WLCSP) and Bare Dies.
The turret-based wafer handlers together with Cohu’s NV-Core vision inspection system enable advanced WLCSP and Die Inspection at highest productivity.
Market Leading Inspection Yield with Uncompromised Throughput
Next generation inspection platform optimized for small, fragile semiconductors used in mobility and consumer applications.