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WLCSP Inspection

Guaranteed advanced quality inspection with lowest rejection, with uncompromised throughput, across an entire equipment fleet

Cohu offers a wide range of solutions for Inspection and Packaging of Post-singulated Wafer Level Chip Scale Packages (WLCSP) and Bare Dies.

The Turret-based Wafer handlers together with Cohu’s NVcore vision inspection technology, enables advanced WLCSP and Die Inspection at highest productivity.


Market Leading Inspection Yield with Uncompromised Throughput
Next generation inspection platform optimized for small, fragile semiconductors used in mobility and consumer applications.

Ismeca NY32W

Highest Inspection Yield for Wafer Level Chip Scale Packages and Bare Dies
32-position turret platform for semiconductors on film-frame wafer media, providing the highest inspection yield.