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Automotive Expertise

Delivering reliable solutions supporting the stringent quality requirements of “Zero Defects”

Cohu Automotive Market Test Solutions

Cohu Advantage

  • Leading automotive market experience in test, handling, and interface solutions
  • Best-in-class temperature range and accuracy handlers and interface products
  • Leading provider of Industry 4.0 ready solutions for semiconductor test and inspection
  • Unique T-Core active thermal control (ATC) technology that maximizes test yield
  • Innovative test interface solutions with intelligent contactors to ensure test performance at every insertion
  • Multi-purpose MEMS sensor test platform
  • Test instrumentations for a wide range of modern automotive applications such as ADAS, CAN/LIN and power

Applications

  • Active safety
  • Autonomous driving
  • Consumerization of automotive electronics
  • Electrification of drive-trains
  • Wireless connectivity
  • Infotainment

Test Handler Solutions

MT9928

High Speed Gravity Handler

This well-established test handler provides field proven reliability and performance. Its modular and scalable design and variety of options allow configuration of the MT9928 exactly according to the test needs. Easy-access design and easy-to-change conversion kit parts support fast and easy package style changes. The MT9928 has a large soak capacity and features the entire tri-temp range at outstanding temperature accuracy and stability.

Rasco SO1000

Tube-to-Tube Gravity Handler

The gravity handler with the largest installed base. Due to mature design and high reliability it provides excellent cost of test.  Highly flexible due to a broad range of device kits that can be combined with various Sensor and MEMS applications.

Rasco SO2000

Gravity Handler for Smallest Package

Modular designed gravity handler with various input and output possibilities. Additional ambient chamber for dual temp option available. SO2000 can handle smallest possible packages for Gravity and provides a broad range of Sensor and MEMS applications.

Rasco Jaguar

High Performance Strip Handler

Jaguar is designed for high-volume production testing of ICs on a strip format or in device carrier. It is fully automotive qualified for tri-temperature test and the ideal solution for high parallel testing of small packages at short test times, but also for Power and Sensor devices. Due to the integrated vision alignment and high precision linear motors, Jaguar provides high yield and excellent OEE.

Delta Eclipse XTA

Final Test System Lights Out Factory

The Eclipse XTA combines the essence of the Eclipse XT platform with Industry 4.0 factory automation—the current trend in automation and data exchange in manufacturing technologies. The Eclipse XTA is part of the key customers’ modular structured smart factory, allowing them to be more efficient. The new front-end tray automation and micron accurate designs provide a new level of performance and capabilities to fuel sales and market position. In production, the XTA fleet’s performance is above the goal set by customers. It boasts more than 42,000 mean contact between jams (MCBJ) and runs 3×3 millimeter devices.

Delta MATRiX

High-Performance, Configurable Pick and Place Handler

The MATRiX handler has a highly-flexible test site configuration that’s well suited for a wide range of test applications, including analog ICs with short test times and high throughput, automotive devices requiring accurate thermal control, small pitch wireless communication products, high parallel microcontroller testing, MEMS device testing, and many other device market segments with their unique requirements. The MATRiX has a highly flexible test site configuration that enables customers to reuse existing load-boards, including boards made for competitor’s legacy handlers.

MT9510

Tri-Temp Pick and Place Handler

The MT9510 XP / MT9510 x16 is a universal pick and place handler for packages such as QFP, BGA, Micro-BGA, CSP, TSSOP, PLCC,  PGA, LGA, MLP/MLF.

The MT9510 XP ensure fully reliable test of packages in cold, hot or ambient test conditions. Based on its outstanding temperature performance, the MT9510 XP provides solutions for managing medium power dissipation in a cost-efficient way.

The MT9510 x16 continues the MT9510 XP features in terms of reliability, temperature performance and advanced options.

Solstice

System Level Test Burn-in Solution

High volume System-Level Test that is affordable for long test times. Parallelism up to 396 DUTs to achieve a throughput of up to 5,000 UPH. Combine this throughput with a small factory floor footprint to achieve the industry’s lowest cost of system-level test.

Ismeca NY20

Highest Throughput for Fragile Devices

20-position turret platform for semiconductors test, inspection and packaging, providing the highest quality yield and throughput. It integrates innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity.

The NY20 also integrates with Cohu’s latest advance inspection technologies such as, 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with high resolution camera.

Ismeca NY32

Highest Demanding Finishing Processes

32-position turret platform for semiconductors test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as intelligent features that enables extended autonomous operation and productivity.

The NY32 also integrates Cohu’s latest advance inspection technologies such as, 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with high resolution camera.

Ismeca NY32W

Highest Inspection Yield for Wafer Chip Scale Level Packages and Bare Dies

32-position turret platform for semiconductors on film-frame wafer media, providing highest inspection yield. Integrating innovative hardware and software technologies such as intelligent features that enables extended autonomous operation and productivity.

The NY32W also integrates Cohu’s latest advanced inspection technologies such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

Inspection Solutions

Neon

Market Leading Inspection Yield with Uncompromised Throughput

Neon can handle fragile wafer level chip scale products at high speed, maintaining high operational efficiency while inspecting small devices down to 0.4 x 0.2 mm in size. It features extended process integration capabilities and can be configured with infrared and visual micro-scale defect inspection modules. It is also equipped with an external loader unloader to integrate with factory robots for customers adopting Industry 4.0 initiatives.

The Neon also integrates Cohu’s latest advanced inspection technologies such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

Ismeca NY32W

Highest Inspection Yield for Wafer Level Chip Scale Packages and Bare Dies

32-position turret platform for semiconductors on film-frame wafer media, providing highest inspection yield. Integrating innovative hardware and software technologies such as intelligent features that enables extended autonomous operation and productivity.

The NY32W also integrates Cohu’s latest advanced inspection technologies such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

NV-Core

Inspection to serve overall machine performance

NV-Core is Cohu’s unique vision technology, enabling advanced inspection capabilities across Cohu’s handler portfolio.

NV-Core latest advance inspection technologies include innovative solution such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection for sub-surface defect detection.

In addition to device quality inspection, by mastering the “all-in-one” solution, Cohu can offer unique capabilities for handler’s diagnostics and alignments, that enable the highest productivity performance.

Semiconductor ATE Solutions

Diamondx

Flexible, Cost Optimized Test Solutions for the Most Challenging Applications

Diamondx test system extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost drivers IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.

Diamondx DxV

Changes the Rules of Design Through to Production Test

The Diamondx DxV provides full semiconductor ATE performance in a desktop PC footprint. Fully integrated, ultra-compact test system designed to be used in the engineering lab or office. Unlike traditional semiconductor ATE solutions no mainframe, separate workstation, or support cabinets needed. TheDiamondx DxV is completely stand-alone, so it can be placed on a bench or desktop.

PAx

Market Leading Test System for High Volume RF PA / FEM, 5G and Mobility Devices

PAx’s flexible architecture allows configurations of a wide range of instruments that are designed to address the test challenges for RF power amplifiers and front-end modules used in cellular and connectivity applications, including WLAN standards up to Wi-Fi 6, 2G to 5G wireless and beyond, Bluetooth and a variety of IoT standards. Many of these new generation wireless devices require ever more demanding RF test capabilities from test instruments, such as wider bandwidths and lower EVM, and PAx’s configurable architecture delivers the optimized test solution with superior RF performance at an uncompromised cost of test.

Cohu has a number of ATE instruments focused on the Automotive market

Test Contactor / Probe Head Solutions

Reduced site to site pitch concept enables high parallel test for power applications on strip-test and pick and place handler platforms

Excellent RF Performance with Low Cost of Ownership

cDragon pin’s thermal design supports fast temperature control response and stabilization for repeatable at temperature testing of devices in a handler environment.

By design the cDragon’s pin decouples insertion motion from the test-interface-board side of the pin. This eliminates test-interface-board pad wear.

cDragon’s low profile and high bandwidth with low inductance makes it an ideal contacting solution for testing of mobile communications, RF switches, A/D converters, LNA’s, and PMIC devices. cDragon’s pins affinity to solder migration will ensure low and repeatable contact resistance.

cDragon can be used for testing any perimeter pad devices (QFN, DN, PLCC) and leaded packages (QFP, SO).

Compact multi-beam pin structure for high density system integration on Turret Handlers with Side-by-side design for very small pad sizes

High Performance Kelvin Contact for High Volume Production Test

cPython Kelvin contactors and probe heads provide superior electrical and thermal performance with significant cost savings. This makes cPython Kelvin ideal for lab and high-volume production test of analog and mixed signal integrated circuits – for applications such as power control, A-D and D-A converters, audio, video, power amplifiers, photonics, optical MEMS and sensors.

cPython Kelvin probes are electrically isolated and mechanically independent force and sense paths for true Kelvin contact for taking accurate measurements, even under high current conditions. These robust probes provide hundreds of thousands of insertions or touchdowns, and a bandwidth up to 26 GHz.  cPython Kelvin probes can land on 0.4 mm pitch targets, and their tip spacing is 90 µm to land on small targets. cPython probes are available with homogeneous tips to optimize performance.

Cantilever Contactor for High Power Applications

ecoAmp Kelvin is a high power cantilever kelvin contactor with patented spring and tip design for optimum heat dissipation. This ensures best reliability, long spring life and high yield even under highest current and temperature requirements.

Proven Cantilever Technology for MCUs and ASICs

MiCon is spring pin footprint compatible supporting advanced temperature requirements as well as advanced power/current requirements. The footprint compatibility allows for easy and cost-efficient conversion from spring pin setups. The fully decoupled load board side of the spring ensure no degradation of the load board pad.

MiCon features a single piece design, which ensures a long lifespan, low and stable contact resistance, high current carrying capability and an extended temperature range. The MiCon allows for testing at full specification values. The extended operating range accommodates device lead trim and form variability such as device alignment accuracy and device lead coplanarity.

Kelvin test socket for high power plunge-to-board applications

nanoKelvin is a well-established cantilever kelvin contactor with proven performance in the automotive market and further increasing popularity due to the robustness and reliability of the product.

Broadband Production Solution for cmWave and mmWave up to 100 GHz

The xWave contactor utilizes patented hybrid contacting technology to optimize RF performance and provide robustness for production testing of the most challenging cmWave and mmWave devices. Inside the xWave contactor are embedded patch antennas and coplanar waveguides for both wireless and wired communication.

In addition to wireless communication xWave contactors minimize the number of transitions between the DUT and tester through the use of co-planar waveguide structures that make direct connection with the DUT, bypass the PCB, and connect to the tester with either coaxial cable or waveguides.