Excellent RF Performance and Reliability for Tri-Temperature Production Test with Low Cost of Ownership
cDragon pin’s thermal design supports fast temperature control response and stabilization for repeatable at temperature testing of devices in a handler environment.
By design the cDragon’s pin decouples insertion motion from the test-interface-board side of the pin. This eliminates test-interface-board pad wear.
cDragon’s low profile and high bandwidth with low inductance makes it an ideal contacting solution for testing of mobile communications, RF switches, A/D converters, LNA’s, and PMIC devices. cDragon’s pins affinity to solder migration will ensure low and repeatable contact resistance.
cDragon can be used for testing any perimeter pad devices (QFN, DFN) and leaded packages (QFP, SO).