Mobility Expertise
Enabling the explosive growth in data traffic and processing.
Enabling the explosive growth in data traffic and processing.
Cohu has a leading position in testing RF Front-End ICs, application processors, WLCSPs, both in semiconductor test, handler platforms, and interface solutions.
Application Processors
Flat Panel Display Drivers
Near-Field Communications
Best-in-class RF measurement performance for PA/FEM, <4G, 5G, Wi-Fi 6/6E/7, and mmWave.
Unique T-Core Active Thermal Control (ATC) technology enables the testing of very high-power processors.
Contactor platform with a direct signal path for mmWave applications up to 100 GHz. Probe technology spanning 5G FR1 and FR2, high-density PMIC Kelvin contactors, also suitable for challenging package geometries.
FPD driver test capability available on a low-cost configurable SOC test platform.
Advanced motion control technology for fragile WLCSP testing on a low-cost configurable test handler.
Unique NV-Core advanced vision with infrared technology to inspect below the silicon surface and metrology tools to distinguish micro-cracks from cosmetic issues.
MT9928 – This well-established test handler provides field-proven reliability and performance. Its modular and scalable design and variety of options allow configuration of the MT9928 exactly according to the test needs. Easy-access design and easy-to-change conversion kit parts support fast and easy package style changes. The MT9928 has a large soak capacity and features the entire tri-temp range at outstanding temperature accuracy and stability.
Jaguar – designed for high-volume production testing of ICs on a strip format or in device carrier.
MCT SH-5300 – designed for testing advanced semiconductor packages, LED’s MEMS sensors, and traditional ICs.
NY32-LU – is a highly efficient and flexible loading/unloading of InCarrier, including vision inspection and final packaging. Controlled and sensitive device handling with Cohu’s high precision turret and enhanced vision capabilities with NV-Core Inspection System. With our scalable concept, one system could be used as a Loader and Unloader or depending on the desired output, a dedicated Loading or Unloading system can be configured and optimized.
MCT MH-3300 – designed for marketing of 2DiD codes on the lead frame in support of strip testing, marking of reject devices, and final package marketing in strip test or assembly operations.
MCT FH-1200 – designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages.
We offer innovative concepts for the automotive MEMS market; magnetic, inertial, pressure, microphone, optical, humidity and gas sensor test. Cohu MEMS solutions combine the advantages of well-established and production-proven tri-temp test handling equipment with innovative concepts to meet the special requirements of the MEMS market.
Sense+ – next-generation MEMS sensor test platform allows for significant improvement in test accuracy, parallelism for a lower cost of test, and the ability to handle and inspection, small delicate sensors. Fully configured Sense+ delivers a one-pass automated test, inspection, and metrology for the most complex MEMS devices including <1 mm WLCSP.
Delta Eclipse – is part of the key customers’ modular structured smart factory, allowing them to be more efficient. The new front-end tray automation and micron accurate designs provide a new level of performance and capabilities to fuel sales and market position. In production, the XTA fleet’s performance is above the goal set by customers. It boasts more than 42,000 mean contact between jams (MCBJ) and runs 3×3 millimeter devices.
Ismeca NY20 – 20-position turret platform for semiconductors test, inspection and packaging, providing the highest quality yield and throughput. It integrates innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity. The NY20 also integrates with Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with a high-resolution camera.
Ismeca NY32 – 32-position turret platform for semiconductors test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity. The NY32 also integrates Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with a high-resolution camera.
Ismeca NY32W – 32-position turret platform for semiconductors on film-frame wafer media, providing the highest inspection yield. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity. The NY32W also integrates Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.
Neon – can handle fragile wafer level chip scale products at high speed, maintaining high operational efficiency while inspecting small devices down to 0.4 x 0.2 mm in size. It features extended process integration capabilities and can be configured with infrared and visual micro-scale defect inspection modules. It is also equipped with an external loader unloader to integrate with factory robots for customers adopting Industry 4.0 initiatives.
Ismeca NY20 – 20-position turret platform for semiconductors test, inspection and packaging, providing the highest quality yield and throughput. It integrates innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity. The NY20 also integrates with Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with a high-resolution camera.
Ismeca NY32 – 32-position turret platform for semiconductors test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity. The NY32 also integrates Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with a high-resolution camera.
NV-Core – is Cohu’s unique vision technology, enabling advanced inspection capabilities across Cohu’s handler portfolio. NV-Core latest advance inspection technologies include innovative solution such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection for sub-surface defect detection. In addition to device quality inspection, by mastering the “all-in-one” solution, Cohu can offer unique capabilities for handler’s diagnostics and alignments, that enable the highest productivity performance.
Diamondx – extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost drivers IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.
PAx – flexible architecture allows configurations of a wide range of instruments that are designed to address the test challenges for RF power amplifiers and front-end modules used in cellular and connectivity applications, including WLAN standards up to Wi-Fi 6, 2G to 5G wireless and beyond, Bluetooth and a variety of IoT standards.
cPython Kelvin Contactor/Probe Head – provides superior electrical and thermal performance with significant cost savings. This makes cPython Kelvin ideal for lab and high-volume production test of analog and mixed signal integrated circuits – for applications such as power control, A-D and D-A converters, audio, video, power amplifiers, photonics, optical MEMS and sensors. cPython Kelvin probes are electrically isolated and mechanically independent force and sense paths for true Kelvin contact for taking accurate measurements, even under high current conditions.
xWave Contactor/Probe Head – utilizes patented hybrid contacting technology to optimize RF performance and provide robustness for production testing of the most challenging cmWave and mmWave devices. Inside the xWave contactor are embedded patch antennas and coplanar waveguides for both wireless and wired communication.
ACE Contactor/Probe Head – offers optimal RF performance for fine pitch FBGA, QFN and wafer-level packages for Power Amplifiers, RF switches and mobile communications. Supporting pitches down to 0.4 mm and superior performance for current consumption, gain, standard deviation, and power efficiency.
Atlas Contactor/Probe Head – offers electrical performance that allows the customer to test to the true performance of the device. Atlas WLCSP test contactors achieve mechanical reliability with a rigid “cruciform” tip applied to Cohu’s QuadTech flat probe technology. The Atlas offers a short electrical path, with lower capacitance and inductance, that is ideal for functional and AC parametric testing of WLCSP devices that require high system bandwidth and throughput gains in large multisite test applications.
cBoa Contactors/Probe Head – the solution for contacting high frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogeneous DUT side plunger provides longer run times between cleaning and increased probe life.
cViper Probe Head – ultra-fine-pitch probe head for RF and high speed digital WLCSP and Known-Good-Die applications are ideal for lab and large volume production test of precision analog, RF, sensors and mobility devices.
RF Scrub Contactor – extremely short signal path rugged probe with high wear resistance for SO, DFN, and QFN packages. RF Scrub contactor’s innovative design combines an extremely short signal path (0.90mm test height) with high wear resistance pins that can operate in a wide temperature range (-40º C to +150º C).
Gemini Kelvin Contactor/Probe Head – provide a first-rate solution that effortlessly makes reliable, true kelvin contact for high-volume final test of both singulated packages and wafer-level devices. Gemini Kelvin is an ideal solution for devices such as power controllers, A-D and D-A converters, power amplifiers and audio and video circuits.
Mercury Contactor/Probe Head – excellent spring probes for the laboratory though they were designed with the robust qualities needed for high-volume production test. Their unique design ensures excellent plating quality for low, consistent resistance, long life, and high-test yields.
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