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Mobility Expertise

Enabling the explosive growth in data traffic and processing

Cohu Mobility Market Test Solutions

Cohu Advantage

  • Industry leading RF capability
  • Unique T-Core active thermal control (ATC) solutions for mobile processors
  • Best-in-class RF measurement performance for Power Amplifier and Front-End Module test
  • Flat Panel Display driver test capability available on a low-cost configurable SOC test platform
  • High performance interface solutions, including Over-the-Air (OTA) mmWave applications and WLP probe heads
  • Low-cost configurable test handler
  • High volume vision inspection and metrology tools
  • Advanced motion control technology for fragile WLCSP handling

Applications

  • Application processors (tablets, phones)
  • Connectivity
  • General RF devices
  • FPD drivers
  • NFC
  • PMIC
  • Transition from 3G/4G to 5G standards

Test Handler Solutions

High Parallel Test

PANTHER Power

All-in-One Test and Inspection System for small package ICs

PANTHER Power enables higher production yield with integrated test and inspection cell with high parallel tri temp testing for small leadless packages, QFN / DFN .

It uses a chamber-less thermal technology, with six soaking stations. Coupled to a Cohu thermo pre-conditioned contactor, it guarantees a high stability in temperature at full range, from -45 °C to +155 °C.

PANTHER Power offers the most reliable testing cell for small devices at high speed with unlimited test parallelism.

PANTHER WLCSP

High Performance Post Singulated Test

PANTHER WLCSP is a breakthrough technology in post singulation testing. It provides the lowest Cost Of Test for high volume QA and or customer return testing for singulated WLCSP, under real probing condition with direct docking at high parallelism and with 100% touch down efficiency.

PANTHER WLCSP guarantees 100% output quality with post singulation test and inspection with Micro scale defect detection.

Rasco Jaguar

High Performance Strip Handler

Jaguar is designed for high-volume production testing of ICs on a strip format or in device carrier. It is fully automotive qualified for tri-temperature test and the ideal solution for high parallel testing of small packages at short test times, but also for Power and Sensor devices. Due to the integrated vision alignment and high precision linear motors, Jaguar provides high yield and excellent OEE.


Pick and Place

Delta Eclipse XT

Highly Configurable Scalable Pick and Place Handler

Eclipse XT delivers scalable performance for testing a wide range of semiconductors, from analog ICs to high performance mobile processors. The Eclipse XT is a high speed pick-and-place handler designed to test up to 16 Integrated Circuits (ICs) in parallel, at temperatures from -45°C to +155°C*, with throughput up to 13,000 units per hour.

Featuring Cohu’s proprietary T-Core thermal controller and a variety of cooling systems in order to provide precise, multi-site temperature management of power dissipative ICs, optimizing test yield of next generation IC’s. It also enables both IDM and Fabless customers to test high-end processors used in augmented virtual reality and deep-learning applications, giving continuity to Cohu’s leadership in advanced thermal test. Eclipse XT offers flexibility for both OSATs, IDM and Fabless customers with its wide market coverage through field configurability.

*device type dependent

Delta Eclipse XTA

Final Test System Lights Out Factory

The Eclipse XTA combines the essence of the Eclipse XT platform with Industry 4.0 factory automation—the current trend in automation and data exchange in manufacturing technologies. The Eclipse XTA is part of the key customers’ modular structured smart factory, allowing them to be more efficient. The new front-end tray automation and micron accurate designs provide a new level of performance and capabilities to fuel sales and market position. In production, the XTA fleet’s performance is above the goal set by customers. It boasts more than 42,000 mean contact between jams (MCBJ) and runs 3×3 millimeter devices.

Turret Test and Scan

Ismeca NY20

Highest Throughput for Fragile Devices

20-position turret platform for semiconductors test, inspection and packaging, providing the highest quality yield and throughput. It integrates innovative hardware and software technology such as Intelligent Features that enable extended autonomous operation and productivity.

The NY20 also integrates with Cohu’s latest Advance Inspection technologies such as, 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with high resolution camera.

Ismeca NY32

Highest Demanding Finishing Processes

32-position turret platform for semiconductors test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as Intelligent Features that enables extended autonomous operation and productivity.

The NY32 also integrates Cohu’s latest Advance Inspection technologies such as, 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with high resolution camera.

Ismeca NY32W

Highest Inspection Yield for Wafer Level Packages and Bare Dies

32-position turret platform for semiconductors on film-frame wafer media, providing highest inspection yield. Integrating innovative hardware and software technologies such as Intelligent Features that enables extended autonomous operation and productivity.

The NY32W also integrates Cohu’s latest Advanced Inspection technologies such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

System Level Test

Solstice

System Level Test Burn-in Solution

High volume System Level Test that is affordable for long test times. Parallelism up to 396 DUTs to achieve a throughput of up to 5,000 UPH. Combine this throughput with a small factory floor footprint to achieve the industry’s lowest cost of system-level test.

Inspection Solutions

WLCSP Inspection

Neon

Market Leading Inspection Yield with Uncompromised Throughput

Neon is Cohu’s next generation inspection platform optimized for small, fragile semiconductors used in mobility and consumer applications.

Neon can handle fragile wafer level chip scale products at high speed, maintaining high operational efficiency while inspecting small devices down to 0.4 x 0.2 mm in size. It features extended process integration capabilities and can be configured with infrared and visual micro-scale defect inspection modules. It is also equipped with an external loader unloader to integrate with factory robots for customers adopting Industry 4.0 initiatives.

Neon  is designed to provide our customers with the best price/performance ratio in the industry, targeting semiconductors used in handset and small consumer electronics applications for high volume die sort needs.

Ismeca NY32W

Highest Inspection Yield for Wafer Level Packages and Bare Dies

32-position turret platform for semiconductors on film-frame wafer media, providing highest inspection yield. Integrating innovative hardware and software technologies such as Intelligent Features that enables extended autonomous operation and productivity.

The NY32W also integrates Cohu’s latest Advanced Inspection technologies such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

NVcore Vision System

NVcore

Inspection to serve overall machine performance

NVcore is Cohu’s unique vision technology, enabling Advanced Inspection capabilities across Cohu’s handler portfolio.

NVcore latest Advance Inspection technologies include innovative solution such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection for sub-surface defect detection.

In addition to device quality inspection, by mastering the “all-in-one” solution, Cohu can offer unique capabilities for handler’s diagnostics and alignments, that enable the highest productivity performance.

Semiconductor ATE Solutions

Test Systems

Diamondx

Flexible, Cost Optimized Test Solutions for the Most Challenging Applications

Diamondx test system extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost driver’s IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.

PAx

Market Leading Test System for High Volume RF PA / FEM, 5G and Mobility Devices

PAx’s flexible architecture allows configurations of a wide range of instruments that are designed to address the test challenges for RF power amplifiers and front-end modules used in cellular and connectivity applications, including WLAN standards up to Wi-Fi 6, 2G to 5G wireless and beyond, Bluetooth and a variety of IoT standards. Many of these new generation wireless devices require ever more demanding RF test capabilities from test instruments, such as wider bandwidths and lower EVM, and PAx’s configurable architecture delivers the optimized test solution with superior RF performance at a uncompromised cost of test.

Instrumentation

Cohu has a number of ATE instruments focused on the Mobility market

Test Contactor / Probe Head Solutions

ACE Contactor / Probe Head

Cost Efficient RF Contactor for FBGA and Wafer-Level Packages

ACE test contactor offers optimal RF performance for fine pitch FBGA, QFN and wafer-level packages for Power Amplifiers, RF switches and mobile communications. Supporting pitches down to 0.4 mm and superior performance for current consumption, gain, standard deviation, and power efficiency.

ACE probe head provides exceptional electrical performance, both DC and RF and is manufactured from HyperCore™ base material, which is a proprietary material of Cohu’s Everett Charles Technologies.

Compatible with all device types, platings, and pitches; and all test applications, including singulated devices, strip test and wafer-scale test. The materials and architecture create a very robust probe with a very working life and best yield. The electrical and mechanical performance, combined with the long probe life, deliver low overall cost of test, which are unprecedented for RF contactors.

Atlas Contactor / Probe Head

Optimal Performance for Large I/O Count Devices and High-End Digital

QuadTech probe solution with cruciform tip strength that stands up to lateral force without bending, plus an enhanced compliance window to accommodate package stack height tolerance.

Atlas offers electrical performance that allows the customer to test to the true performance of the device. Atlas WLCSP test contactors achieve mechanical reliability with a rigid “cruciform” tip applied to Cohu’s QuadTech flat probe technology.  The Atlas offers a short electrical path, with lower capacitance and inductance, that is ideal for functional and AC parametric testing of WLCSP devices that require high system bandwidth and throughput gains in large multisite test applications.

The cruciform tip provides increased tip rigidity with a much greater immunity to breakage. The advantages for the customer include increased run times between contactor cleaning, increased probe life, increased yield, and reduced system down time for contactor maintenance.

cBoa Contactor / Probe Head

Cost-Effective, High-Performance Contactor or Probe Head for High-Volume Production Test

cBoa contactors and probe heads are the solution for contacting high frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogenous DUT side plunger provides longer run times between cleaning and increased probe life.

The cBoa features a stainless-steel spring for tri-temp testing and performs in operating temperatures of -55°C to +155°C. With a bandwidth up to 27 GHz, cBoa can be used to test some of the highest frequency devices.

The enhanced compliance window accommodates package stack height tolerances well.

cDragon Contactor

Excellent RF Performance with Low Cost of Ownership

cDragon pin’s thermal design supports fast temperature control response and stabilization for repeatable at temperature testing of devices in a handler environment.

By design the cDragon’s pin decouples insertion motion from the test-interface-board side of the pin. This eliminates test-interface-board pad wear.

cDragon’s low profile and high bandwidth with low inductance makes it an ideal contacting solution for testing of mobile communications, RF switches, A/D converters, LNA’s, and PMIC devices. cDragon’s pins affinity to solder migration will ensure low and repeatable contact resistance.

cDragon can be used for testing any perimeter pad devices (QFN, DFN, PLCC) and leaded packages (QFP, SO).

cPython Kelvin Contactor / Probe Head

High Performance Kelvin Contact for High Volume Production Test

cPython Kelvin contactors and probe heads provide superior electrical and thermal performance with significant cost savings.  This makes cPython Kelvin ideal for lab and high-volume production test of analog and mixed signal integrated circuits – for applications such as power control, A-D and D-A converters, audio, video, power amplifiers, photonics, optical MEMS and sensors.

cPython Kelvin probes are electrically isolated and mechanically independent force and sense paths for true Kelvin contact for taking accurate measurements, even under high current conditions. These robust probes provide hundreds of thousands of insertions or touchdowns, and a bandwidth up to 26 GHz. cPython Kelvin probes can land on 0.4 mm pitch targets, and their tip spacing is 90 µm to land on small targets. cPython probes are available with homogeneous tips to optimize performance.

cViper Probe Head

High Performance Probe Head for High Volume Production Test

cViper ultra-fine-pitch probe heads for RF and high speed digital WLCSP and Known-Good-Die applications are ideal for lab and large volume production test of precision analog, RF, sensors and mobility devices. With low loop inductance, bandwidth up to 25 GHz, and low and stable contact resistance, cViper is an ideal choice for thorough testing of WLCSP and bumped die for MCM and COB applications. cViper probes are available in 100, 150, and 200 µm  minimum pitch and are manufactures with variety of contact materials to optimize performance.

Gemini Kelvin Contactor / Probe Head

Industry preferred high performance, high value, low cost true kelvin QuadTech contacting solution

Gemini Kelvin probes and contactors provide a first-rate solution that effortlessly makes reliable, true Kelvin contact for high-volume final test of both singulated packages and wafer-level devices. Gemini Kelvin is an ideal solution for devices such as power controllers, A-D and D-A converters, power amplifiers and audio and video circuits.

At 3.22 mm test height, the Gemini Kelvin is an excellent all-around spring probe with low inductance, high bandwidth, and excellent current-carrying capacity. The DUT side tip design accurately maintains its 100 µm spacing for the life of the probe. Customers report typical probe life of 500 k to 800 k package insertions, or over 2M touchdowns at wafer-level test. The offset tip allows manageable board layout with a board-side spacing of 0.4 mm.

Mercury Contactor / Probe Head

Industry preferred high performance, high value, low cost QuadTech contacting solution

Mercury probes and contactors are excellent spring probes for the laboratory though they were designed with the robust qualities needed for high-volume production test. Their unique design ensures excellent plating quality for low, consistent resistance, long life, and high-test yields. Mercury probes are available with minimum pitches of 0.3 mm, 0.4 mm, 0.5 mm, and 0.8 mm, to provide the best performance at any device pitch. Mercury probes have bandwidths of up to 22 GHz, and can carry over 3 Amps of current. The Mercury is an excellent choice for any test application.

RF Scrub Contactor

Excellent RF performance with low cost of ownership

Extremely short signal path rugged probe with high wear resistance for SO, DFN, and QFN packages

RF Scrub Contactor’s innovative design combines an extremely short signal path (0.90mm test height) with high wear resistance pins that can operate in a wide temperature range (-40º C to +150º C).

The RF Scrub contactor’s long-life, elastomer free design and easy field maintainability makes it an optimal solution for testing of high-performance devices.

The RF Scrub design minimizes load board wear and with the unique pin base material and plating, the cleaning intervals can last up to 100,000 cycles.

The RF Scrub contactor is adaptable to multiple packages (QFN/DFN/MLF, QFP, SO, SOT, TO) and handler platforms making it an ideal low-cost solution for your RF and acoustic applications.

xWave Contactor / Probe Head

Broadband Production Solution for cmWave and mmWave up to 100 GHz

The xWave contactor utilizes patented hybrid contacting technology to optimize RF performance and provide robustness for production testing of the most challenging cmWave and mmWave devices. Inside the xWave contactor are embedded patch antennas and coplanar waveguides for both wireless and wired communication.

In addition to wireless communication xWave contactors minimize the number of transitions between the DUT and tester through the use of co-planar waveguide structures that make direct connection with the DUT, bypass the PCB, and connect to the tester with either coaxial cable or waveguides.