Substantial increase in test accuracy & output
Sense+™ ultra-precise MEMS & sensor test automation platform allows for significant improvement in test accuracy, parallelism for a lower cost of test, and the ability to handle and inspect, small delicate sensors. Fully configured, Sense+ delivers a one-pass automated test, inspection, and metrology for the most complex MEMS devices including <1 mm WLCSP.
- Full 6-sided post testing die inspection
- Micro-scale visible defect inspection down to 50 µm
- Vision assisted accurate die placement
- Completed unit-level traceability
- Pre-tape pocket integrity, in-tape device quality, and post-sealing quality inspection capabilities
- Real-time equipment monitoring and management
- Preventative maintenance
- Central recipe management
- Optimized yield and defect detection through real-time Artificial Intelligence inspection
- Knowledge database and unified reports
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