BGA Package Interface Solutions
Challenges and Solutions for Contacting Ball Grid Array Devices
Ball Grid Array packages have been in use for over twenty years now, yet the numbers are still growing. It is a very versatile package that offers many advantages in terms of contact density and overall contact count. Not only do the high-ball-count BGAs provide numerous I/O paths for highly integrated devices, they also can improve current-delivery capability and voltage stability for high-power devices by providing massively parallel power and ground paths.
The BGA is also supports miniaturization as the package of choice for WLCSP devices.