Aquilae Infrared Module

Infrared solution for sidewall, backside and intape inspection

The continuous increase of product quality requirements in IoT, mobility and automotive markets are driving the need for upstream detection of silicon defects on integrated circuits, which are not otherwise identifiable via electrical test.

Infrared imaging has the ability to see through silicon, inspecting the structure underneath the surface that is not otherwise observable with traditional vision inspection systems. Cohu’s unique innovation offers a breakthrough by integrating infrared imaging for enhanced micro-crack and sub-surface detection on wafer level chip scale packages (WLCSPs) onto a high-speed automation platform that delivers an economical solution for high quality inspection.

  • Key Features

    • Down to 1 µm defect size detection
    • Inner micro-crack detection
    • Ability to see through silicon, inspecting the structure underneath the surface
  • Applications

    • Automotive
    • Internet of Things (IoT)
    • Mobility