Key Features
- Down to 5 µm Defect Size Detection
- Dedicated µCrack Algorithm
- 1 HR Image per Component Side
Aquilae HR Sidewall Module
For enhanced micro-crack detection on Wafer Level Chip Scale Packages (WLCSPs)
Advances in functionality and product reliability in the IoT, mobility and automation markets are driving the need for early detection of defects at a micrometer scale. Cohu’s Aquilae solution is designed to identify micro-cracks on an integrated circuit that often go undetected using only electrical test, ultimately minimizing end-product failures.
The AquilaeTM inspection module combines a high-resolution camera with dedicated image processing algorithms to offer a breakthrough solution for early detection of micro-cracks WLCSPs and bumped dies. Providing this level of inspection enables semiconductor manufacturers to ensure the highest level of product quality, which is imperative in high-end applications.
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