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Package Type
BGA Packages
Ball Grid Array packages are very versatile packages that offers many advantages in terms of contact density and
overall contact count.
QFN / DFN / MLF Packages
Quad Flat No-Lead / Dual Flat No-Lead / Micro Lead Frame are leadframe or organic substrate based
packages that are usually encapsuled in a rectangular plastic body with contact pads on two or four sides.
QFP Packages
QPFs are leadframe based packages that are usually encapsuled in a rectangular plastic body with leads
extending from four sides.
SO Packages
Small Outline packages are leadframe-based and usually encapsulated in a rectangular plastic body with leads
extending out two sides.
WLCSP Packages
Wafer Level Chip Scale Packages have been in use for over a decade years now, and the number of
devices packed this way continues to grow at a significant pace.
WLCSPs are the primary choice for mobile devices for this reason.
Expertise
Learn more about our Interface Solutions.
