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QFN / DFN / MLF Package Interface Solutions

Challenges and Solutions for Contacting Quad Flat No-Lead / Dual Flat No-Lead / Micro Lead Frame

DFN / QFN / MLFs are leadframe or organic substrate based packages that are usually encapsuled in a rectangular plastic body with contact pads on two or four sides. For better thermal performance, most DFN /QFN / MLFs have exposed pads, typically on the bottom of the device. DFN /QFN / MLFs are industry standard sized and the pads are typically spaced at pitches ranging from 0.35 mm to 0.65 mm.

DFN Package Solutions

Test Contactor / Probe Head Solutions

Cost Efficient RF Contactor for FBGA and Wafer-Level Packages

ACE Test Contactor offers optimal RF performance for fine pitch FBGA, QFN and wafer-level packages for Power Amplifiers, RF switches and mobile communications. Supporting pitches down to 0.4 mm and superior performance for current consumption, gain, standard deviation, and power efficiency.

ACE Probe Head provides exceptional electrical performance, both DC and RF and is manufactured from HyperCore™ base material, which is a proprietary material of Cohu’s ECT Contact Product Group.

Compatible with all device types, platings, and pitches; and all test applications, including singulated devices, strip test and wafer-scale test. The materials and architecture create a very robust probe with a very working life and best yield. The electrical and mechanical performance, combined with the long probe life, deliver low overall cost of test, which are unprecedented for RF contactors.

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Cost-Effective, High-Performance Contactor or Probe Head for High-Volume Production Test

cBoa contactors and probe heads are the solution for contacting high frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogenous DUT side plunger provides longer run times between cleaning and increased probe life.

The cBoa features a stainless-steel spring for tri-temp testing and performs in operating temperatures of -55°C to +155°C. With a bandwidth up to 27 GHz, cBoa can be used to test some of the highest frequency devices.

The enhanced compliance window accommodates package stack height tolerances well.

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Excellent RF Performance with Low Cost of Ownership

cDragon pin’s thermal design supports fast temperature control response and stabilization for repeatable at temperature testing of devices in a handler environment.

By design the cDragon’s pin decouples insertion motion from the test-interface-board side of the pin. This eliminates test-interface-board pad wear.

cDragon’s low profile and high bandwidth with low inductance makes it an ideal contacting solution for testing of mobile communications, RF switches, A/D converters, LNA’s, and PMIC devices. cDragon’s pins affinity to solder migration will ensure low and repeatable contact resistance.

cDragon can be used for testing any perimeter pad devices (QFN, DN, PLCC) and leaded packages (QFP, SO).

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For leaded and leadless devices down to 0.3 mm x 0.6 mm

Compact multi-beam pin structure for high density system integration on turret handlers with side-by-side design for very small pad sizes.,

cHybrid Kelvin contactor contains a new and unique contact spring architecture which allows the test socket to adapt to challenging IC pad geometry requirements of todays and future small package types. Great lifetime up to 3 million touchdowns, with best-in-class contact resistance repeatability reduces cost of test significantly. A multibeam contact structure optimizes signal integrity and current capability according to challenging electrical test requirements.

cHybrid Kelvin contactor with multibeam contact spring architecture delivers improved yield and long life which minimizing cleaning cycles. This innovative solution will help customers reduce cost and maximize productivity.

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High performance kelvin contact for high volume production test

cPython Kelvin contactors and probe heads provide superior electrical and thermal performance with significant cost savings. This makes cPython Kelvin ideal for lab and high-volume production test of analog and mixed signal integrated circuits – for applications such as power control, A-D and D-A converters, audio, video, power amplifiers, photonics, optical MEMS and sensors.

cPython Kelvin probes are electrically isolated and mechanically independent force and sense paths for true Kelvin contact for taking accurate measurements, even under high current conditions. These robust probes provide hundreds of thousands of insertions or touchdowns, and a bandwidth up to 26 GHz.  cPython Kelvin probes can land on 0.4 mm pitch targets, and their tip spacing is 90 µm to land on small targets. cPython probes are available with homogeneous tips to optimize performance.

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Lowest COT for next-generation 5G mmWave FR2 up to 54+ GHz

cRacer utilizes robust spring probe technology for testing singulated packages or probe heads for wafer probe (bumped/pad) applications with fine pitch and WLCSP compatibility – ranging from 150 µm to 650 µm, covering the majority of 5G devices.

cRacer features a stainless-steel spring for tri-temp testing and performance in operating temperatures -55°C to +155°C.

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Cantilever contactor for high power applications

ecoAmp Kelvin is a high power cantilever kelvin contactor with patented spring and tip design for optimum heat dissipation. This ensures best reliability, long spring life and high yield even under highest current and temperature requirements.

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Industry preferred high performance, high value, low cost True Kelvin QuadTech contacting solution

Gemini Kelvin probes and contactors provide a first-rate solution that effortlessly makes reliable, true Kelvin contact for high-volume final test of both singulated packages and wafer-level devices. Gemini Kelvin is an ideal solution for devices such as power controllers, A-D and D-A converters, power amplifiers and audio and video circuits.

At 3.22 mm test height, the Gemini Kelvin is an excellent all-around spring probe with low inductance, high bandwidth, and excellent current-carrying capacity. The DUT side tip design accurately maintains its 100 µm spacing for the life of the probe. Customers report typical probe life of 500 k to 800 k package insertions, or over 2M touchdowns at wafer-level test. The offset tip allows manageable board layout with a board-side spacing of 0.4 mm.

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Industry preferred high performance, high value, low cost QuadTech contacting solution

Mercury probes and contactors are excellent spring probes for the laboratory though they were designed with the robust qualities needed for high-volume production test. Their unique design ensures excellent plating quality for low, consistent resistance, long life, and high-test yields. Mercury probes are available with minimum pitches of 0.3 mm, 0.4 mm, 0.5 mm, and 0.8 mm, to provide the best performance at any device pitch. Mercury probes have bandwidths of up to 22 GHz, and can carry over 3 Amps of current. The Mercury is an excellent choice for any test application.

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Kelvin test socket for high power plunge-to-board applications

nanoKelvin is a well-established cantilever kelvin contactor with proven performance in the automotive market and further increasing popularity due to the robustness and reliability of the product.

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Excellent RF performance with low cost of ownership

Extremely short signal path rugged probe with high wear resistance for SO, DFN, and QFN packages

RF Scrub Contactor’s innovative design combines an extremely short signal path (0.90mm test height) with high wear resistance pins that can operate in a wide temperature range (-40º C to +150º C).

The RF Scrub contactor’s long-life, elastomer free design and easy field maintainability makes it an optimal solution for testing of high-performance devices.

The RF Scrub design minimizes load board wear and with the unique pin base material and plating, the cleaning intervals can last up to 100,000 cycles.

The RF Scrub contactor is adaptable to multiple packages (QFN/DFN/MLF, QFP, SO, SOT, TO) and handler platforms making it an ideal low-cost solution for your RF and acoustic applications.

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Broadband Production Solution for cmWave and mmWave up to 100 GHz

The xWave contactor utilizes patented hybrid contacting technology to optimize RF performance and provide robustness for production testing of the most challenging cmWave and mmWave devices. Inside the xWave contactor are embedded patch antennas and coplanar waveguides for both wireless and wired communication.

In addition to wireless communication xWave contactors minimize the number of transitions between the DUT and tester through the use of co-planar waveguide structures that make direct connection with the DUT, bypass the PCB, and connect to the tester with either coaxial cable or waveguides.

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  • Contacting Challenges

    • High currents
    • High voltages
    • Recessed pads
    • Device asymmetry
    • Kelvin test
    • Tin migration
    • High contact spring wear on NiPd platings
    • Tin oxide on leads

  • Contactor Features

    • Self-cleaning wipe
    • Wide spring tips
    • High contact force
    • Relatively high surface area for heat dissipation
    • Relatively high thermal mass
    • Durable one piece design
    • Low and stable contact resistance
    • High current carrying capability
    • Large mechanical operating window for stable contactor performance

  • Package Features

    • Wide variety of pitches, sizes, and pin counts
    • Used for a wide range of applications
    • Low cost packages
    • Typically NiPd or tin plated
    • Most have exposed ground pad
    • Very high volume

Expertise

Learn more about our Interface Solutions.