Neon

Market Leading Inspection Yield with Uncompromised Throughput

Neon is Cohu’s next generation inspection platform optimized for small, fragile semiconductors used in automotive, consumer, industrial and medical, and mobility applications.

Neon can handle fragile wafer level chip scale products at high speed, maintaining high operational efficiency while inspecting small devices down to 0.2 x 0.4 mm in size. It features extended process integration capabilities and can be configured with infrared and visual micro-scale defect inspection modules. It is also equipped with an external loader unloader to integrate with factory robots for customers adopting Industry 4.0 initiatives.

Neon is designed to provide our customers with the best price/performance ratio in the industry, targeting semiconductors used in handset and small consumer electronics applications for high volume die sort needs.

Cohu Neon WLCSP Inspection

Productivity
- Up to 40,000 UPH with standard 6S inspection
- Up to 38,000 UPH with HR sidewall inspection
- Unique force limitation control for thin and fragile handling at high speed
- Wafer management and Mapfile processing for enhanced traceability
- Cassette loading / unloading Industry 4.0 ready

Flexibility
- Wide Film Frame Carrier applicable device range (0.2 x 0.4 mm to 12 x 12 mm)
- Available in 16 or 32 pickup arms for process optimization
- Up to 23 available turret positions to accommodate required process
- Complete integrated solution for backend finishing process
  
  Flip and Non-Flip process capable
  
  Detaping to Tape process capable
  
  Multi-Taping output capable
  
  Full 6 sides inspection

Unique Inspection Applications
- Aquilae HR Sidewall Module: Micro-scale visible defect inspection down to 5 µm
- Aquilae Infrared Module: Inner cracks detection on silicon devices
- 3D Flex® Vision: True 3D inspection for Balls/Bumps
- ViewMap®: Wafer mapping, quality map merging and skeleton check

Available Options
- 16 or 32 Turret pickup arms to fit customer required process
- Flip/Chip module under Turret for non-Flip process
- Carrier Tape Input for RMA
- 2nd, 3rd Taping Output
- ESD Class 0 with Monitoring

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