Neon
WLCSP Inspection & Metrology
Up to 50,000 UPH for devices ≤1 x 1 mm
Up to 5% higher inspection yield.
Neon™ inspection & metrology platform for next generation WLCSP and QFN is optimized for small, fragile semiconductors used in automotive, consumer, industrial, computing and mobility applications. A completely integrated solution offering flip and non-flip process, detaping to tape process, multi-taping output and full 6-sided inspection.
HBM Market Alignment: Neon supports an efficient output sorting process, addresses both current and future HBM market requirements. Fully compatible between HBM3E, HBM4 and HBM4E, with no system modification. Architected to integrate seamlessly with factory automation. Designed for advanced packages requiring high-end production process flow and unit traceability.
Highly Efficient Vision Technology Delivers Accurate and Reliable Metrology of Micro-Pillars across each High Bandwidth Device.
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Market Leading Inspection Yield with Uncompromised Throughput
Neon inspection & metrology platform can handle fragile wafer-level chip scale products at high-speed, maintaining high operational efficiency while inspecting small devices down to 0.2 x 0.4 mm in size. It features extended process integration capabilities and can be configured with infrared and visual micro-scale defect inspection modules. Available in 16 or 32 pickup arms for process optimization. It is also equipped with an external cassette loader unloader to integrate with factory robots for customers adopting Industry 4.0 initiatives.
Up to 50,000 UPH for devices ≤1 x 1 mm (45,000 ≤2 x 2 mm) with HR Visible or Infrared Top, Bottom and Sidewall Inspection. Run WLCSP and QFN devices and processes on the same system.
Neon also features Cohu’s PAICe Digital Twin Platform providing real-time equipment monitoring and data analytics for Industry 4.0/Factory Automation.
Neon is designed to provide our customers with the best price/performance ratio in the industry, targeting semiconductors used in handset, high bandwidth memory, and small consumer electronics applications for high volume die sort needs.
Latest News
Cohu Enters HBM Memory Market with Neon Inspection Metrology Platform
Cohu Secures Additional Neon Orders, Raises 2025 Forecasted HBM Revenue to $10-11M
- Highly efficient vision technology delivers accurate and reliable metrology of thousands of micro-pillars inspection
- Cohu’s PAICe Inspection utilizes deep learning and neural network-based pattern recognition to improve inspection yield
- Architected to integrated seamlessly with factory automation and efficient output sorting process addresses current roadmap HBM market needs
Smart Factory Automation on Neon
Designed for Advanced Packages Requiring High-End Production Process Flows and Unit Traceability.
SECS/GEM300
Software Compliant
Film Frame FOUP (FFF)
Cassette Handling Capability
Overhead Hoist Transport with
Load Port Integration
Resulting in a Fully Automated Material Flow
Integration with Factory Automation and Efficient Output Sorting Process Addresses Current and Roadmap HBM Market Needs.
Available Options
- 16 or 32 Turret pickup arms to fit customer required process
- Flip/Chip module under Turret for non-Flip process
- Carrier Tape Input for RMA
- 2nd, 3rd Taping Output
- ESD Class 0 with Monitoring
Unique Inspection Options
- Aquilae HR Sidewall: Micro-scale visible defect inspection down to 5 µm
- Aquilae Infrared: Inner cracks detection on silicon devices
- 3D Flex® Vision: True 3D inspection for Balls/Bumps
- Unique Twin Wafer and ViewMap to increase throughput
Software Analytics Options
- Real-time equipment monitoring and management
- Preventative Maintenance
- Central Recipe Management
- Knowledge Database and Unified Reports
Micro-Scale Defect Detection, 6-Sided Visible and Infrared Inspection and 3D Max Vision System
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