Market Leading Inspection Yield with Uncompromised Throughput

Neon can handle fragile wafer-level chip scale products at high-speed, maintaining high operational efficiency while inspecting small devices down to 0.2 x 0.4 mm in size. It features extended process integration capabilities and can be configured with infrared and visual micro-scale defect inspection modules. Available in 16 or 32 pickup arms for process optimization. It is also equipped with an external loader unloader to integrate with factory robots for customers adopting Industry 4.0 initiatives.

Up to 50,000 UPH for devices ≤1 x 1 mm (45,000 ≤2 x 2 mm) with HR Visible or Infrared Top, Bottom and Sidewall Inspection. Run WLCSP and QFN devices and processes on the same system.

Neon  is designed to provide our customers with the best price/performance ratio in the industry, targeting semiconductors used in handset and small consumer electronics applications for high volume die sort needs.