Neon™ inspection & metrology platform for next generation WLCSP and QFN is optimized for small, fragile semiconductors used in automotive, consumer, industrial and medical, and mobility applications. A completely integrated solution offering flip and non-flip process, detaping to tape process, multi-taping output and full 6-sided inspection.
- 16 or 32 Turret pickup arms to fit customer required process
- Flip/Chip module under Turret for non-Flip process
- Carrier Tape Input for RMA
- 2nd, 3rd Taping Output
- ESD Class 0 with Monitoring
Complete our contact form.
Learn more about our Inspection and Metrology Solutions