Proven Cantilever Technology for MCUs and ASICs
MiCon is spring pin footprint compatible supporting advanced temperature requirements as well as advanced power/current requirements. The footprint compatibility allows for easy and cost-efficient conversion from spring pin setups. The fully decoupled load board side of the spring ensure no degradation of the load board pad.
MiCon features a single piece design, which ensures a long lifespan, low and stable contact resistance, high current carrying capability and an extended temperature range. The MiCon allows for testing at full specification values. The extended operating range accommodates device lead trim and form variability such as device alignment accuracy and device lead coplanarity.