cHybrid Turret Kelvin
For Leaded and Leadless Devices Down to 0.3 mm x 0.6 mm
Compact Multi-Beam Pin Structure for High Density System Integration
Kelvin and non-Kelvin configurations available for high density system integration on Turret Handlers with side-by-side design for very small pad sizes.
cHybrid™ Kelvin contactor contains a new and unique contact spring architecture which allows the test socket to adapt to challenging IC pad geometry requirements of todays and future small package types. Great lifetime up to 3 million touchdowns, with best-in-class contact resistance repeatability reduces cost of test significantly. A multi-beam contact structure optimizes signal integrity and current capability according to challenging electrical test requirements.
cHybrid Kelvin contactor with multi-beam contact spring architecture delivers improved yield and long life minimizing cleaning cycles. This innovative solution will help customers reduce cost and maximize productivity.
Key Features
Very Small Pad Sizes
Side-by-side for very small pad sizes 0.15 x 15 mm
Packages
QFN, DFN, SO, SOT.
Electrical
Current carrying capacity up to 3.0 A continuous. Maximum peak current 25A @ 1% duty cycle.
Denmark Pin
Denmark pin material prevents solder migration.
Contact Resistance
Contact resistance 40 MΩ.
Long Cleaning Intervals
50,000 cycles for pure pin.
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Expertise
Learn more about our Interface Solutions
