Krypton
Next Generation Package Inspection Platform
30% higher throughput per capital cost in package inspection
KryptonTM is Cohu’s new inspection & metrology platform for large semiconductor packages. Krypton delivers high-speed vision addressing the increased requirements for higher quality in automotive, industrial, mobility, and advanced package applications. Krypton is configured with Cohu’s NV-Core vision technology suite, including 3D metrology capability for precise measurements and artificial intelligence to optimize yield of 2D surface inspection.
Delivers State-of-the-Art Inspection with up to 30% Higher Throughput and Uptime Compared to Existing Solutions
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Disruptive Closed-Loop Technology Delivers High Productivity Without Impacting Production Throughput
Tray to Tray and Tray to Tape
Krypton is a full 6-sided inspection & metrology system for high-end semiconductor packages, based on its unique race-track architecture combined with Cohu’s sophisticated NV-Core vision technology, it delivers state-of-the-art inspection with up to 30% higher throughput and uptime compared to existing solutions.
The systems disruptive closed-loop racetrack architecture delivers high productivity through fast sorting, automatic yield recovery and direct sort of good and defective device without impact on production throughput. Automatic second pass enables defective device re-inspection capability to optimize yield gain. Krypton saves IC device manufacturers’ inspection & metrology equipment 30% in capital expenses by inspecting, measuring, and sorting packages efficiently and enabling automatic re-inspection capability to optimize yield gain.
Krypton also features Cohu’s PAICe Digital Twin Platform providing real-time equipment monitoring and data analytics for Industry 4.0/Factory Automation, to significantly improve overall equipment efficiency, increase inspection yield, and maximize device output per machine.
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Unique Inspection and Metrology
- Full 6-sided single unit post testing inspection and metrology
- Visible and infrared inspection capability
- True 3D measurement at 6 µm repeatability
- Micro-scale defect detection down to 20 µm
- Full 1D or 2D ID unit-level traceability from tray input to tape & reel and tray output
- Vision assisted accurate device placement
Software Analytics
- Real-time equipment monitoring and management
- Preventative Maintenance
- Central Recipe Management
- Knowledge Database and Unified Reports
Micro-Scale Defect Detection, 6-Sided Visible and Infrared Inspection and 3D Max Vision System
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