High-Performance Field Repairable Direct-Attach Probe Cards
cStrider High Power Probe Card
Cohu’s production-proven test cell solutions enable the high-voltage and high-current requirements to ramp power bare die silicon carbide (SiC) MOSFETs and Schottky diodes, and gallium nitride high electron mobility transistors (GaN HEMTs) automotive and industrial devices. Patent pending Volta-flux™ high-power density solution enables identical contact elements for singulated power Known Good Die (KGD) and wafer probing, with field-replaceable MEMS probes providing significantly lower cost of test.
cStrider wafer probing high parallel test solution innovative pressure-level control during high-voltage test process enables probing efficiency on wafer edges. Single pin replacement allows on-site repair providing significant lower cost of test.
- Efficient heat dissipation extends lifetime at high current density
- Multi-site press control technology for high-voltage testing improves yield and test efficiency
- Scalable design enables up to 32 site testing delivering lower cost of test
- Modular horizontal MEMS probes are field repairable enhancing operational efficiency
cRacer 60 GHz Multisite Probe Card
Probe card technologies are limited in their ability to operate at higher frequencies and scale to multisite testing. They typically can solve one of these challenges but not both concurrently. Leveraging Cohu’s final-test proven RF technology, we have developed a multisite probe card that delivers at-speed performance up to 60 GHz that is needed for 5G FR2 and other mmWave transceivers. We have simplified the probe card with a unique direct attach construction technique, eliminating the costly MLO space transformer while reducing the number of transmission line transitions. Field replaceable probes provide reduced downtime and world-class cost of ownership.
- 60 GHz bandwidth for mmWave signals
- 100 µm pitch, direct-attach PCB technology
- Output impedance matching 35 Ω to 75 Ω
- Octal site with 600+ probes per site
- Robust, field replaceable probes
- Manual Test option for all eight sites
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Probe Head Key Features
Temperature
Features a stainless-steel spring for tri-temp testing and performance in operating temperatures -55 ̊C to +155 ̊C.
Packages
BGA, FBGA, LGA, Pad, QFN, and WLCSP. Singulated packages, strip test and wafer-level chip scale test.
Optimized Dielectic Impedance
Matched impedance significantly improves insertion loss and return loss. Process can be applied at all pitches.
Low Loop Inductance and High Bandwidth
High signal integrity and power delivery for RF devices.
Floating Alignment Plate
Optional floating alignment plate provides higher continuity yield.
Variety of Contact Materials
Optimizing performance through resistance stability and longer usable life.
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