Field Repairable Direct Attach Wafer Probe
60 GHz Octal Site Wafer Test Probe Card for 5G mmWave
Traditional advanced probe card technologies are limited in their ability to operate at higher frequencies and scale to multisite testing. They typically can solve one of these challenges but not both concurrently. Leveraging Cohu’s RF technology, we have developed a multisite probe card that delivers at speed performance up to 60 GHz that is needed for mmWave. We have also simplified the probe card with a unique direct attach construction technique, eliminating a costly component and source of noise in the signal chain to the instrumentation.
- 60 GHz bandwidth for mmWave MB signals (direct test +loopback)
- 150 µm pitch, direct-attach PCB technology
- Octal site with 600+ I/Os per site
- 35 Ω impedance for mmWave MB signals
- Manual Test option for all eight sites
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Probe Head Key Features
Temperature
Features a stainless-steel spring for tri-temp testing and performance in operating temperatures -55 ̊C to +155 ̊C.
Packages
BGA, FBGA, LGA, Pad, QFN, and WLCSP. Singulated packages, strip test and wafer-level chip scale test.
Optimized Dielectic Impedance
Matched impedance significantly improves insertion loss and return loss. Process can be applied at all pitches.
Low Loop Inductance and High Bandwidth
High signal integrity and power delivery for RF devices.
Floating Alignment Plate
Optional floating alignment plate provides higher continuity yield.
Variety of Contact Materials
Optimizing performance through resistance stability and longer usable life.
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Expertise
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