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Ismeca NY20

Highest Throughput for Fragile Devices

20-position turret platform for semiconductor test, inspection and packaging, provides the highest quality yield and throughput. It integrates innovative hardware and software technology such as Intelligent Features that enable extended autonomous operation and productivity.

The NY20 also integrates with Cohu’s latest Advance Inspection technologies such as, 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with high resolution camera.

Product Sheet

  • Process Flexibility

    • Bowl / Tube Feeder Input
    • Up to 8 Test Sites
    • 6 Sides Inspection
    • Tape and Reel / Tube Output
    • In-Tape Inspection with Auto-Reject and Replacement
    • Bulk / Tube Reject

  • Productivity

    • Up to 50,000 UPH
    • Robustness with MTBA >120 min
    • Auto Breakdown Recovery (ABR)
    • Auto Pickup Head Calibration (APC)
    • Auto Height Correction (AHC)
    • Device Trajectory Control (DTC)
    • NVcore – Cohu’s next generation Vision Inspection
    • Fast conversion

  • Device Type

    • QFN, DFN 0.3 x 0.6 mm -> 12 x 12 mm
    • SOT, SC, SOD 1.0 x 0.6 mm -> 6 x 6 mm
    • SO, TSSOP, TO, D2PAK
    • LED

  • Available Options

    • LED Testing (full flux or intensity)
    • High Resolution Camera
    • Laser Marking Integration
    • Auto Reel Changer (ARC)
    • Metal Magazine input
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