HYDRA COAX
Test Contactor
Optimized for HPC/AI Devices
HYDRA COAX
FT and SLT Production-Proven Contactor for High-Speed Digital Applications up to 448 Gbps
Coaxial, Impedance-Controlled Test Contactor
The HYDRA COAX™ (formerly ICON™) test contactor designed specifically for maintaining the native impedance of the device-under-test (DUT) through the contactor to the test system, maximizing high frequency power transfer by minimizing signal reflections (Return Loss).
The metal body is a Faraday shield/cage, which reduces cross talk (electromagnetic radiation) the primary cause of signal jitter. Along with this, the aluminum body blocks both static and non-static external electric fields (random noise). Featuring exceptional DC and RF performance and excellent thermal management.
With data rates up to 448 Gbps and bandwidths exceeding 60 GHz, ICON is ideal for FPGA, GPU, SerDes, DDR, PAM4, HDMI, PCIEx, HDMI, 800G and 1.6T Ethernet, SATCom, 5G mmWave RF Transceivers.
Supports silicon photonics integration for optical engine and CPO testing.
Key Highlights
- Up to 60 GHz / 448 Gbps with broadband RF / HSIO performance
- Impedance optimized for each interface standard. Full path shielding for minimum cross talk
- Current carrying above 3A per probe ISMI
- Supports 0.3mm to 1.0mm pitch packages
- Scalable design to 120 mm x 120 mm size and 20,000 probes and beyond
- Standardized high compliance probes and snap-in insulators minimize cost, enable full field repairability
- Supports silicon photonics integration for optical engine and CPO testing
Coaxial Design with Aluminum Shielding Reduces Cross Talk and Electromagnetic Interference
Key Features
Scalable and Flexible Design
Supports fine-pitch applications from 0.3 mm to 1.0 mm, and device sizes up to 120 mm x 120 mm and beyond. Suitable for BGA / LGA. Singulated devices, strip test, or wafer test. Enabling reliable testing from compact ICs to large high-pin count packages.
Stringent Signal Performance
Coaxial design with aluminum shielding reduces cross talk and electromagnetic interference. Signal paths completely surrounded by ground from DUT to PCB pad. Ensures clean signal transmission even at extreme speeds.
Thermal and Mechanical Robustness
Aluminum body delivers exceptional thermal conductivity and mechanical rigidity. Field repairable standardized high compliance probes and snap-in insulators.
Impedance-Controlled Coaxial Architecture
Maintains native impedance from the device-under-test (DUT) to the test system, minimizing signal reflections and maximizing high-frequency power transfer.
Electrical Current
Current carrying capacity up to 2.7 A continuous.
Temperature
Temperature range -55 ̊C to +155 ̊C.
Ideal for FPGA, GPU, SerDes, PAM4, DDR, PCIe, HDMI, 800G and 1.6T Ethernet
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