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QFP Package Interface Solutions

Challenges and Solutions for Contacting Quad Flat Pack Devices

QPFs are leadframe based packages that are usually encapsuled in a rectangular plastic body with leads extending from four sides. For better thermal performance, some QFPs have exposed pads, typically on the bottom of the device. QFPs are industry standard sized and the leads are typically spaced at pitches ranging from 0.35 mm to 1.27 mm.

QFP Package Test Solutions

Test Contactor / Probe Head Solutions

cBoa Contactor / Probe Head

Cost-Effective, High-Performance Contactor or Probe Head for High-Volume Production Test

cBoa contactors and probe heads are the solution for contacting high frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogenous DUT side plunger provides longer run times between cleaning and increased probe life.

The cBoa features a stainless-steel spring for tri-temp testing and performs in operating temperatures of -55°C to +155°C. With a bandwidth up to 27 GHz, cBoa can be used to test some of the highest frequency devices.

The enhanced compliance window accommodates package stack height tolerances well.

cDragon Contactor

Excellent RF Performance with Low Cost of Ownership

cDragon pin’s thermal design supports fast temperature control response and stabilization for repeatable at temperature testing of devices in a handler environment.

By design the cDragon’s pin decouples insertion motion from the test-interface-board side of the pin. This eliminates test-interface-board pad wear.

cDragon’s low profile and high bandwidth with low inductance makes it an ideal contacting solution for testing of mobile communications, RF switches, A/D converters, LNA’s, and PMIC devices. cDragon’s pins affinity to solder migration will ensure low and repeatable contact resistance.

cDragon can be used for testing any perimeter pad devices (QFN, DN, PLCC) and leaded packages (QFP, SO).

cPython Kelvin Contactor / Probe Head

High performance kelvin contact for high volume production Test

cPython Kelvin contactors and probe heads provide superior electrical and thermal performance with significant cost savings. This makes cPython Kelvin ideal for lab and high-volume production test of analog and mixed signal integrated circuits – for applications such as power control, A-D and D-A converters, audio, video, power amplifiers, photonics, optical MEMS and sensors.

cPython Kelvin probes are electrically isolated and mechanically independent force and sense paths for true Kelvin contact for taking accurate measurements, even under high current conditions. These robust probes provide hundreds of thousands of insertions or touchdowns, and a bandwidth up to 26 GHz.  cPython Kelvin probes can land on 0.4 mm pitch targets, and their tip spacing is 90 µm to land on small targets. cPython probes are available with homogeneous tips to optimize performance.

Gemini Kelvin Contactor / Probe Head

Industry preferred high performance, high value, low cost true kelvin QuadTech contacting solution

Gemini Kelvin probes and contactors provide a first-rate solution that effortlessly makes reliable, true Kelvin contact for high-volume final test of both singulated packages and wafer-level devices. Gemini Kelvin is an ideal solution for devices such as power controllers, A-D and D-A converters, power amplifiers and audio and video circuits.

At 3.22 mm test height, the Gemini Kelvin is an excellent all-around spring probe with low inductance, high bandwidth, and excellent current-carrying capacity. The DUT side tip design accurately maintains its 100 µm spacing for the life of the probe. Customers report typical probe life of 500 k to 800 k package insertions, or over 2M touchdowns at wafer-level test. The offset tip allows manageable board layout with a board-side spacing of 0.4 mm.

Mercury Contactor / Probe Head

Industry preferred high performance, high value, low cost QuadTech contacting solution

Mercury probes and contactors are excellent spring probes for the laboratory though they were designed with the robust qualities needed for high-volume production test. Their unique design ensures excellent plating quality for low, consistent resistance, long life, and high-test yields. Mercury probes are available with minimum pitches of 0.3 mm, 0.4 mm, 0.5 mm, and 0.8 mm, to provide the best performance at any device pitch. Mercury probes have bandwidths of up to 22 GHz, and can carry over 3 Amps of current. The Mercury is an excellent choice for any test application.

MiCon Contactor

Proven cantilever technology for MCUs and ASICs

MiCon is spring pin footprint compatible supporting advanced temperature requirements as well as advanced power/current requirements. The footprint compatibility allows for easy and cost-efficient conversion from spring pin setups. The fully decoupled load board side of the spring ensure no degradation of the load board pad.

MiCon features a single piece design, which ensures a long lifespan, low and stable contact resistance, high current carrying capability and an extended temperature range. The MiCon allows for testing at full specification values. The extended operating range accommodates device lead trim and form variability such as device alignment accuracy and device lead coplanarity.

nanoKelvin Contactor

Kelvin test socket for high power plunge-to-board applications

nanoKelvin is a well-established cantilever kelvin contactor with proven performance in the automotive market and further increasing popularity due to the robustness and reliability of the product.

RF Scrub Contactor

Excellent RF performance with low cost of ownership

Extremely short signal path rugged probe with high wear resistance for SO, DFN, and QFN packages.

RF Scrub Contactor’s innovative design combines an extremely short signal path (0.90mm test height) with high wear resistance pins that can operate in a wide temperature range (-40ºC to +150ºC).

The RF Scrub contactor’s long-life, elastomer free design and easy field maintainability makes it an optimal solution for testing of high-performance devices.

The RF Scrub design minimizes load board wear and with the unique pin base material and plating, the cleaning intervals can last up to 100,000 cycles.

The RF Scrub contactor is adaptable to multiple packages (QFN/DFN/MLF, QFP, SO, SOT, TO) and handler platforms making it an ideal low-cost solution for your RF and acoustic applications.

  • Contacting Challenges

    • High currents
    • High voltages
    • Co-planarity issue
    • Lead geometry issues
    • Device asymmetry
    • Kelvin test
    • Tin migration
    • High contact spring wear on NiPd platings
    • Tin oxide on leads
  • Contactor Features

    • Self-cleaning wipe
    • Wide spring tips
    • High contact force
    • Relatively high surface area or heat dissipation
    • Relatively high thermal mass
    • Durable one piece design
    • Low and stable contact resistance
    • High current carrying capability
    • Large mechanical operating window for stable contactor performance
  • Package Features

    • Wide variety of pitches, sizes, and pin counts
    • Wide range of applications
    • Low cost packages
    • Typically NiPd or tin plated
    • Can have exposed ground pad
    • Very high volume