MEMS Inertial Test

Sense+ with g-sense for testing Accelerometers and Gyroscope Sensors.

MEMS Inertial Test

Sense+ with g-sense for testing Accelerometers and Gyroscope Sensors.

Cohu´s inertial solutions enable high precise Gyroscope and Accelerometer test with best-in-class cost of test due to high parallelism and package flexibility. Cohu stimulus modules guarantee high precision and velocity stability. For Low-g and gyroscope application, our batch handling solutions provide the highest coverage of package size down to 0.8 x 0.8 mm with maximum parallelism and batch carrier density up to 250. With a maximum of 3060 signal lines, we enable low-g acceleration and gyroscope test in all three axis.

All-in-One System for Testing, Calibration, Final Inspection and Packaging.

Significant Improvement in Test Accuracy and Parallelism

The g-sense™ test solution when combined with the Sense+^™ automation platform delivers state-of-the-art testing of interial sensors with up to 3060 lines under test in parallel. The system delivers high throughput test and inspection of small, delicate devices. The isolated architecture conducts the tests in a low-sound environment significantly increasing test accuracy and output, with no need to stop handling for idle or silent mode. With no special requirements for anechoic rooms or chambers on the production floor, the solution delivers cost-effective, high-throughput manufacturing of advanced gyroscopic and accelerometer sensors.

The Sense+ system features 32-position turret test and scan complete finishing solution with full 6-sided optical inspection. NV-Core Inspection System provides full final inspection and unit-level traceability from tray or bowl input to tape & reel output.

PAICe Digital Twin Platform provides real-time equipment monitoring and data analytics for increased productivity.

The g-sense test solution can be mechanical de-coupled from the Sense+ system for use as a standalone unit for engineering in a lab environment.

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Sense+ System with g-sense Test Solution

(Wafer to T&R)

Cohu's Sense+ Automation platform featuring inertial g-sense gyroscope testing.

High-Volume Production

Sense+ MEMS Sensor Automation Platform

g-sense Test Solution Standalone

(Engineering)

Lab or Low-Volume Manufacturing

Sense+ MEMS Sensor Automation Platform

Flexibility

g-sense test solution is independent of the Sense+ handling solution with maximum freedom of movement
Skip movement can be used for constant velocity test
The test solution can be used as an engineering system in a lab environment
Solutions for different packages across different loading media
Flexibility to reconfigure the system to test different sensors

Productivity

Architecture isolates the test of MEMS from outside noise or vibration, significantly increasing test accuracy and output
No special requirements for anechoic rooms or chambers on the production floor for either the handling system or the tester
System keeps running while testing and trimming
Up to 3,060 signal lines (shielded)
Covering all types of inertial test: high-g and low-g acceleration, gyroscope and sinusoidal movement
Can be utilized as incoming quality control at final assembly locations

Accuracy

Stable angular velocity: Yaw rate +/- 0.005%
High position accuracy: Axes +/- 0.1 degree (typ. 0.05 degree)
Noise level on DUT position: less than 10 Hz:typ. 270 μg rms

High Parallelism

Up to 3060 signal lines (shielded)

Temperature Range

Ambient

Package Sizes

0.8 x 0.8 mm to 15 x 15 mm package handling. Sense+ supports handling and vision inspection of advanced MEMS wafer-level chip scale packages.

Testing

Constant velocity in three axis, sinusoidal, earth gravity filed in three axis, high-g test in two axis and 45 degrees

Upgradeable

The test solution can be used as a standalone unit for engineering or upgraded to a full production system.

INSPECTION

NV-Core Inspection System

Full 6-sided post testing die inspection
Micro-scale defect detection down to 50 µm
Vision assisted accurate die placement
Completed unit-level traceability from wafer input to tape & reel output
Pre-tape pocket integrity, in-tape device quality, and post-sealing quality inspection capabilities