MEMS Inertial Test
Sense+ with g-sense for testing Accelerometers and Gyroscope Sensors.
Cohu´s inertial solutions enable high precise Gyroscope and Accelerometer test with best-in-class cost of test due to high parallelism and package flexibility. Cohu stimulus modules guarantee high precision and velocity stability. For Low-g and gyroscope application, our batch handling solutions provide the highest coverage of package size down to 0.8 x 0.8 mm with maximum parallelism and batch carrier density up to 250. With a maximum of 3060 signal lines, we enable low-g acceleration and gyroscope test in all three axis.
The g-sense™ test solution when combined with the Sense+™ automation platform delivers state-of-the-art testing of interial sensors with up to 3060 lines under test in parallel. The system delivers high throughput test and inspection of small, delicate devices. The isolated architecture conducts the tests in a low-sound environment significantly increasing test accuracy and output, with no need to stop handling for idle or silent mode. With no special requirements for anechoic rooms or chambers on the production floor, the solution delivers cost-effective, high-throughput manufacturing of advanced gyroscopic and accelerometer sensors.
The Sense+ system features 32-position turret test and scan complete finishing solution with full 6-sided optical inspection. NV-Core Inspection System provides full final inspection and unit-level traceability from tray or bowl input to tape & reel output.
DI-Core Data Intelligence System provides real-time equipment monitoring and data analytics for increased productivity.
The g-sense test solution can be mechanical de-coupled from the Sense+ system for use as a standalone unit for engineering in a lab environment.
Stable angular velocity: Yaw rate +/- 0.005%
High position accuracy: Axes +/- 0.1 degree (typ. 0.05 degree)
Noise level on DUT position: less than 10 Hz:typ. 270 μg rms
Up to 3060 signal lines (shielded)
Ambient
0.8 x 0.8 mm to 15 x 15 mm package handling. Sense+ supports handling and vision inspection of advanced MEMS wafer-level chip scale packages.
Constant velocity in three axis, sinusoidal, earth gravity filed in three axis, high-g test in two axis and 45 degrees
The test solution can be used as a standalone unit for engineering or upgraded to a full production system.
DI-Core Data Intelligence System
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