Turret-based handling and back-end finishing equipment
Cohu offers turret-based test handling and back-end finishing equipment for ICs, LEDs and discrete components to the global semiconductor industry. The innovation and technology built into Ismeca products is a commitment to providing the best value and best solutions to customers.
Package Inspection
High throughput inspection system with multi processes and media for advanced packages
Cohu offers a wide range of solutions for inspection and packaging of singulated molded leaded and leadless devices
WLCSP Inspection
Guaranteed advanced quality inspection with lowest rejection, without throughput compromise, across an entire equipment feet
Cohu offers a wide range of solutions for inspection and packaging of post-singulated wafer level chip scale packages (WLCSP) and Bare Dies.
NV-Core Inspection System
Inspection to serve overall machine performance
NV-Core is Cohu’s unique vision technology, enabling advanced inspection capabilities across Cohu’s handler portfolio.
