Using AI For Fault Detection And Classification In Semiconductor Manufacturing
Classic fault detection and classification has some classic problems. It’s reactive, time-consuming to set up, and any product change involves significant man-hours. Even then, it still misses a lot of problems, which result in scrap. This is where machine learning can excel, because it can sift through huge amounts of data from thousands of sensors and find outliers and patterns. But there’s a big difference between supervised FDC and unsupervised. Jon Herlocker, VP & General Manager of Tignis, A Cohu Analytics Solution, talks with Semiconductor Engineering about the limitations of supervised FDC, which relies on previous faults, and why unsupervised FDC is necessary to reduce scrap and predict where failures will occur. [This is the third part in a seven-part series on AI in manufacturing.]
Products
Company
Sales and Service
Archive
- November 2025
- September 2025
- August 2025
- December 2024
- September 2024
- June 2024
- May 2024
- April 2024
- October 2023
- July 2023
- February 2023
- November 2022
- August 2022
- March 2022
- January 2022
- October 2021
- September 2021
- August 2021
- June 2021
- May 2021
- April 2021
- March 2021
- February 2021
- January 2021
- November 2020
- October 2020
- September 2020
- August 2020
- July 2020
- June 2020
- May 2020
- April 2020
- March 2020





