NY32W is a fully automatic optical testing, visual inspection and die sorting solution. This innovative solution provides customers with the stringent quality required for the automotive industry, while delivering higher productivity and lower cost.
All-in-One Test and Handling Solution
32-position turret test and scan platform for semiconductors on film-frame wafer media, providing the highest inspection yield for wafer-level chip scale and bare dies. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity.
A complete finishing solution with full vision inspection, test contacting, with up to 12″ Wafer Input with 180° Flip-Chip under Turret.
The NY32W features Cohu’s latest advanced inspection technologies such as 3D Flex® for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.
Featuring Cohu’s DI-Core Data Intelligence System providing real-time equipment monitoring and data analytics for Industry 4.0/Factory Automation.
The platform is well suited for radio frequency (RF) devices, small power management ICs, high-power Known Good Die (KGD), solid state lighting devices, such as LEDs, LiDAR and many other ICs in wafer-level chip scale packaging.
Industrial Power Applications
LED and Sensors
Available Options
- LED / Laser LED Testing (full flux or intensity)
- LED Sorting
- Detaping Input
- Laser Marking Integration
- Auto Reel Changer (ARC)
Unique Inspection Options
- Aquilae HR Sidewall: Micro-scale visible defect inspection down to 5 µm
- Aquilae Infrared: Inner cracks detection on silicon devices
- 3D Flex® Vision: True 3D inspection for Balls/Bumps
Data Analytics Options
DI-Core Data Intelligence System
- Real-time equipment monitoring and management
- Preventative Maintenance
- Central Recipe Management
- Knowledge Database and Unified Reports
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Expertise
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