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You are here: Home1 / Technical Papers

TestConX 2020 OTA 5G mmWave Yukang (Dylan) Feng

Spring Probe WLCSP Probe Head CCC – ISMI Characterization Is Not Enough

Solution for mmWave Wafer Probe Applications and Field Results

Over the Air Test Solution for Antenna in Package Applications

OTA Test Solution for High Volume Production Test of AiP devices

On-chip Test with Microstrip Patch Antennas

Measurement Challenges for Over-the-Air Test of Antenna in Package ICs

Cohu_TestConX2021_Mroczkowski

Cohu_TestConX2021_Lonks

Cohu_MEPTEC_2021_JT

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