High Signal Integrity and Power Delivery for RF Devices
The cRacer test contactor and probe head portfolio offer solutions for 5G mmWave FR2 up to 54+ GHz.
cRacer utilizes robust spring probe technology for testing singulated packages or probe heads for wafer probe (bumped/pad) applications with fine pitch and WLCSP compatibility – ranging from 150 µm to 650 µm, covering the majority of 5G devices.
cRacer features a stainless-steel spring for tri-temp testing and performance in operating temperatures -55°C to +155°C.
Each probe pitch includes a cross section and probe technology expected to withstand the production environment for hundreds of thousands of insertions/cycles with low contact resistance. With a bandwidth up to 54+ GHz @-1 dB, cRacer is a cost-effective solution for your high frequency devices.
Features a stainless-steel spring for tri-temp testing and performance in operating temperatures -55 ̊C to +155 ̊C.
BGA, FBGA, LGA, Pad, QFN, and WLCSP. Singulated packages, strip test and wafer-level chip scale test.
Matched impedance significantly improves insertion loss and return loss. Process can be applied at all pitches.
High signal integrity and power delivery for RF devices.
Optional floating alignment plate provides higher continuity yield.
Optimizing performance through resistance stability and longer usable life.
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