Compact Multi-Beam Pin Structure for High Density System Integration
Kelvin and non-Kelvin configurations available for high density system integration on Turret Handlers with side-by-side design for very small pad sizes.
cHybrid Kelvin contactor contains a new and unique contact spring architecture which allows the test socket to adapt to challenging IC pad geometry requirements of todays and future small package types. Great lifetime up to 3 million touchdowns, with best-in-class contact resistance repeatability reduces cost of test significantly. A multi-beam contact structure optimizes signal integrity and current capability according to challenging electrical test requirements.
cHybrid Kelvin contactor with multi-beam contact spring architecture delivers improved yield and long life minimizing cleaning cycles. This innovative solution will help customers reduce cost and maximize productivity.
Side-by-side for very small pad sizes 0.15 x 15 mm
QFN, DFN, SO, SOT.
Current carrying capacity up to 3.0 A continuous. Maximum peak current 25A @ 1% duty cycle.
Denmark pin material prevents solder migration.
Contact resistance 40 MΩ.
50,000 cycles for pure pin.
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