Industrial Expertise

Delivering solutions that automate the industry.

Cohu has a long history of supporting industrial and medical customers and are the leading providing of Industry 4.0 ready solutions for semiconductor test and inspection & metrology.

Automation

Energy Management

Remote Security

Machinery

General Medical ICs

Smart Grids

Customer Benefits

Temperature Control

Handlers and interface solutions with best-in-class thermal accuracy for high parallelism applications addressing the full range of automotive temperature testing.

Active Thermal Control

Unique T-Core Active Thermal Control (ATC) technology enables the testing of very high-power processors.

Intelligent Contactors

Kelvin contact solutions that scale to high power and small footprint to enable high test site density, as well as best-in-class Cost of Test by long lifespan and less cleaning efforts.

Test Instrumentation

High precision DAC and ADC measurement instrumentation and expertise.

MEMS and Sensor Test

Unique architecture to isolate sensors under test from environmental influences, including vibration and noise, enables handling of delicate devices at very high speeds.

Industry 4.0 Ready

Leading provider of I4.0 ready solutions for semiconductor test and inspection & metrology.

SiC and GaN Wide Bandgap Test Cell Solutions

Cohu’s production-proven test cell solutions enable the high-voltage and high-current requirements to ramp power bare die silicon carbide (SiC) MOSFETs and Schottky diodes, and gallium nitride high electron mobility transistors (GaN HEMTs) automotive and industrial devices. Patent pending Volta-flux high-power density solution enables identical contact elements for singulated power Known Good Die (KGD) and wafer probing, with field-replaceable MEMS probes providing significantly lower cost of test.

Singulated Power KGD Test Cell Solution iCohu equipment, the NY32W, cGator contactor and cStrider probe card.

Test Handlers

Gravity

High Speed Gravity Handler

MT9928 – This well-established test handler provides field-proven reliability and performance. Its modular and scalable design and variety of options allow configuration of the MT9928 exactly according to the test needs. Easy-access design and easy-to-change conversion kit parts support fast and easy package style changes. The MT9928 has a large soak capacity and features the entire tri-temp range at outstanding temperature accuracy and stability.

Tube-to-Tube Gravity Handler

Rasco SO1000 – The gravity handler with the largest installed base. Due to mature design and high reliability, it provides excellent cost of test. Highly flexible due to a broad range of device kits that can be combined with various Sensor and MEMS applications.

Gravity Handler for Smallest Package

Rasco SO2000 – Modular designed gravity handler with various input and output possibilities. Additional ambient chamber for dual temp option available. SO2000 can handle the smallest possible packages for Gravity and provides a broad range of Sensor and MEMS applications.

High-Performance Strip Handler

Jaguar – designed for high-volume production testing of ICs on a strip format or in device carrier.

Loader/Unloader

NY32-LU – is a highly efficient and flexible loading/unloading of InCarrier, including vision inspection and final packaging. Controlled and sensitive device handling with Cohu’s high precision turret and enhanced vision capabilities with NV-Core Inspection System. With our scalable concept, one system could be used as a Loader and Unloader or depending on the desired output, a dedicated Loading or Unloading system can be configured and optimized.

High-Throughput Film Frame Handler

MCT FH-1200 – designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages.

Modular Design Concept MEMS and Sensor Solutions

We offer innovative concepts for the automotive MEMS market; magnetic, inertial, pressure, microphone, optical, humidity and gas sensor test. Cohu MEMS solutions combine the advantages of well-established and production-proven tri-temp test handling equipment with innovative concepts to meet the special requirements of the MEMS market.

Sense+ – next-generation MEMS sensor test platform allows for significant improvement in test accuracy, parallelism for a lower cost of test, and the ability to handle and inspection, small delicate sensors. Fully configured Sense+ delivers a one-pass automated test, inspection, and metrology for the most complex MEMS devices including <1 mm WLCSP.

Configurable OSAT Friendly Pick-and-Place

Delta Eclipse – is part of the key customers’ modular structured smart factory, allowing them to be more efficient. The new front-end tray automation and micron accurate designs provide a new level of performance and capabilities to fuel sales and market position. In production, the XTA fleet’s performance is above the goal set by customers. It boasts more than 42,000 mean contact between jams (MCBJ) and runs 3×3 millimeter devices.

High Parallel Tri-Temp Pick-and-Place

Delta MATRiX – handler has a highly flexible test site configuration that’s well suited for a wide range of test applications, including analog ICs with short test times and high throughput, automotive devices requiring accurate thermal control, small pitch wireless communication products, high parallel microcontroller testing, MEMS device testing, and many other device market segments with their unique requirements. The MATRiX has a highly flexible test site configuration that enables customers to reuse existing load-boards, including boards made for competitor’s legacy handlers.

Universal Tri-Temp Pick-and-Place

MT9510 XP / MT9510 x16 is a universal pick and place handler for packages such as QFP, BGA, Micro-BGA, CSP, TSSOP, PLCC, PGA, LGA, MLP/MLF. The MT9510 XP ensures a fully reliable test of packages in cold, hot or ambient test conditions. Based on its outstanding temperature performance, the MT9510 XP provides solutions for managing medium power dissipation in a cost-efficient way. The MT9510 x16 continues the MT9510 XP features in terms of reliability, temperature performance and advanced options.

Highest Throughput for Fragile Devices

Ismeca NY20 – 20-position turret platform for semiconductors test, inspection and packaging, providing the highest quality yield and throughput. It integrates innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity. The NY20 also integrates with Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with a high-resolution camera.

Highest Demanding Finishing Processes

Ismeca NY32 – 32-position turret platform for semiconductors test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity. The NY32 also integrates Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with a high-resolution camera.

Flexible Test and Scan Solution for FFC Devices

Ismeca NY32W – 32-position turret platform for semiconductors on film-frame wafer media, providing the highest inspection yield. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity. The NY32W also integrates Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection technology for sub-surface defect detection.

Inspection and Metrology

WLCSP Inspection

Market Leading Inspection Yield with Uncompromised Throughput

Neon – can handle fragile wafer level chip scale products at high speed, maintaining high operational efficiency while inspecting small devices down to 0.4 x 0.2 mm in size. It features extended process integration capabilities and can be configured with infrared and visual micro-scale defect inspection modules. It is also equipped with an external loader unloader to integrate with factory robots for customers adopting Industry 4.0 initiatives.

Tray to Tray and Tray to Tape

Krypton – Full 6-sided inspection & metrology system for high-end semiconductor packages, based on its unique racetrack architecture combined with Cohu’s sophisticated NV-Core vision technology, it delivers state-of-theart inspection with up to 30% higher throughput and uptime compared to existing systems.

Highest Throughput for Fragile Devices

Highest Demanding Finishing Processes

Inspection to serve overall machine performance

NV-Core – is Cohu’s unique vision technology, enabling advanced inspection capabilities across Cohu’s handler portfolio. NV-Core latest advance inspection technologies include innovative solution such as, 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection for sub-surface defect detection. In addition to device quality inspection, by mastering the “all-in-one” solution, Cohu can offer unique capabilities for handler’s diagnostics and alignments, that enable the highest productivity performance.

Semiconductor Testers

Application Solutions

Semiconductor Tester Solutions for Industrial and Medical

Convertors for medical devices and instrumentation
Touch-screen display
Disk drive preamp read/write
CAN bus applications across diverse markets
Factory automation/DeviceNet
MCU with power management for implanted medical devices

Flexible, Cost Optimized Test Solutions for the Most Challenging Applications

Diamondx – test system extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost drivers IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.

Changes the Rules of Design Through to Production Test

Diamondx DxV – provides full semiconductor ATE performance in a desktop PC footprint. Fully integrated, ultra-compact test system designed to be used in the engineering lab or office. Unlike traditional semiconductor ATE solutions no mainframe, separate workstation, or support cabinets needed. The DxV is completely stand-alone, so it can be placed on a bench or desktop.

Interface Solutions

Cantilever Contactor/Probe Head

Analog and Smart Power Devices

MAXOR cCompact Kelvin Contactor – multisite testing of Analog and Smart Power Devices requiring Kelvin test. Reduced site-to-site pitch concept enables high parallel test for power applications on strip-test and pick and place handler platforms.

High Power Applications

MAXOR ecoAmp Kelvin Cantilever Contactor – high power contactor with patented spring and tip design for optimum heat dissipation. This ensures the best reliability, long spring life and high yield even under the highest current and temperature requirements.

High Power Known Good Die Applications

MAXOR KGD Cantilever Contactor – For wide bandgap Silicon Carbide and GaN high-voltage and high-current known good die applications. The Micro Cantilever enables smart stacking of pins to increase current carrying capability.

High Power Plunge-to-Board Applications

nanoKelvin Cantilever Kelvin Contactor – well-established contactor with proven performance in the automotive market and further increasing popularity due to the robustness and reliability of the product.

Leaded and Leadless Devices

cHybrid Turret Kelvin Contactor – compact multi-beam pin structure for high-density system integration on Turret Handlers with Side-by-side design for very small pad sizes.

Microcontrollers and ASIC Applications

MiCon Cantilever Contactor – spring pin footprint compatible supporting advanced temperature requirements as well as advanced power/current requirements. The footprint compatibility allows for easy and cost-efficient conversion from spring pin setups.

RF Performance

cDragon Cantilever Contactor – excellent RF performance with low cost of ownership. cDragon pin’s thermal design supports fast temperature control response and stabilization for repeatable at temperature testing of devices in a handler environment.

Analog and Mixed Signal Devices

cPython Kelvin Contactor/Probe Head – provides superior electrical and thermal performance with significant cost savings. This makes cPython Kelvin ideal for lab and high-volume production test of analog and mixed signal integrated circuits – for applications such as power control, A-D and D-A converters, audio, video, power amplifiers, photonics, optical MEMS and sensors. cPython Kelvin probes are electrically isolated and mechanically independent force and sense paths for true Kelvin contact for taking accurate measurements, even under high current conditions.

cmWave and mmWave up to 100 GHz

HYDRA xW Contactor/Probe Head – utilizes patented hybrid contacting technology to optimize RF performance and provide robustness for production testing of the most challenging cmWave and mmWave devices. Inside the HYDRA xW contactor are embedded patch antennas and coplanar waveguides for both wireless and wired communication.

High-End Digital and Large I/O Count Devices

Atlas Contactor/Probe Head – offers electrical performance that allows the customer to test to the true performance of the device. Atlas WLCSP test contactors achieve mechanical reliability with a rigid “cruciform” tip applied to Cohu’s QuadTech flat probe technology. The Atlas offers a short electrical path, with lower capacitance and inductance, that is ideal for functional and AC parametric testing of WLCSP devices that require high system bandwidth and throughput gains in large multisite test applications.

High Volume Production Test

cBoa Contactors/Probe Head – the solution for contacting high frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogeneous DUT side plunger provides longer run times between cleaning and increased probe life.

RF and High Speed Digital

cViper Probe Head – ultra-fine-pitch probe head for RF and high speed digital WLCSP and Known-Good-Die applications are ideal for lab and large volume production test of precision analog, RF, sensors and mobility devices.

RF Performance

cDragon Spring Probe Contactor – excellent RF performance with low cost of ownership. cDragon pin’s thermal design supports fast temperature control response and stabilization for repeatable at temperature testing of devices in a handler environment.

Singulated Packages and Wafer Level

Gemini Kelvin Contactor/Probe Head – provide a first-rate solution that effortlessly makes reliable, true kelvin contact for high-volume final test of both singulated packages and wafer-level devices. Gemini Kelvin is an ideal solution for devices such as power controllers, A-D and D-A converters, power amplifiers and audio and video circuits.

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Test Handler Solutions

Semiconductor Tester Solutions

Interface Solutions

Inspection and Metrology Solutions

Industrial Expertise

Customer Benefits

SiC and GaN Wide Bandgap Test Cell Solutions

Test Handlers

High Speed Gravity Handler

Tube-to-Tube Gravity Handler

Gravity Handler for Smallest Package

Inspection and Metrology

Market Leading Inspection Yield with Uncompromised Throughput

Semiconductor Testers

Semiconductor Tester Solutions for Industrial and Medical

Interface Solutions

Analog and Smart Power Devices

High Power Applications

High Power Known Good Die Applications

High Power Plunge-to-Board Applications

Leaded and Leadless Devices

Microcontrollers and ASIC Applications

RF Performance

Products

Expertise

Sales and Service

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