EX Test System

80 Instrument Slots, up to 1024 Digital Pins

The EX Test System configuration is uniquely suited for a variety of applications, including mixed signal SOCs such as baseband, DVD, DTV and other digital consumer applications. Its ability to deliver high pin count and transparent multi-site programs make it ideal for high pin count SOC and SiP device testing. The EX Test System offers a large suite of DC, power, DSP, RF and digital instrumentation that can be configured into a true mixed signal infrastructure.

The EX is part of the X-Series which offer three different configurations, all based off the same instrumentation, software, system architecture and DUT interface. The major difference between the various configurations is the slots available for instrumentation.

  • Highlights

    • Up to 80 instrument slot
    • Up to 1024 digital pins
    • Air cooled
    • Coherent and low noise architecture
    • Support for high power options
    • Low “0” pin cost

  • Key Features

    • Market leading 0 pin infrastructure costs designed for mixed signal testing
    • Cost effective, incremental investment
    • Program and DUT site compatibility across the entire platform
    • 32 RF ports with DragonRF
    • Full featured mixed signal digital pins, up to 1024
    • Tester-independent feature-rich software environment
    • Broad range of DC instruments
    • DSP instruments support both modulation and DUT-centric testing
  • Architecture

    • Unique architecture that provides testing with best UPH/$ and highest quality
    • Small form-factor
    • Air cooled architecture and instruments
    • Energy efficient, low power consumption
  • Applications

    • Power & power management
    • Automotive switches & sensors
    • Audio: CODECS, amplifiers
    • Printer drivers & motor controllers
    • Automotive microcontrollers
    • DSP: digital, MS, analog
    • Converters: precision, high speed, embedded and audio
    • WLAN, WiMAX, DVB, LTE, CDMA, Edge, WCDMA, bluetooth & other emerging standards
    • Multiband RF power amplifiers, RF front end modules
    • Highly integrated mobility devices, including SiP, SoC and single chip cell phones
    • Application processor
    • Wireless baseband