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MX Test System

40 Instrument Slots, up to 512 Digital Pins

MX Test System configuration is architected to provide optimal cost of test for advanced RF wireless, power management, computing and automotive devices. It offers high configurability, with small instrument channel increments, to produce system configurations with a lower cost of test than competitive platforms. The MX offers a large suite of DC, power, DSP, RF and digital instrumentation that can be configured into a true mixed signal infrastructure.

The MX is part of the X-Series which offer three different configurations, all based off the same instrumentation, software, system architecture and DUT interface. The major difference between the various configurations is the slots available for instrumentation.

Cohu MX Semiconductor ATE Test System
  • Highlights

    • Up to 40 instrument slots
    • Up to 512 digital slots
    • Air cooled
    • Coherent and low noise architecture
    • Support for high power options
    • Low “0” pin cost

  • Key Features

    • Market leading 0 pin infrastructure costs designed for mixed signal testing
    • Cost effective, incremental investment
    • Program and DUT site compatibility across the entire platform
    • 32 RF ports with DragonRF
    • Full featured mixed signal digital pins, up to 512
    • Tester-independent feature-rich software environment
    • Broad range of DC instruments
    • DSP instruments support both modulation and DUT-centric testing
  • Architecture

    • Unique architecture that provides testing with best UPH/$ and highest quality
    • Small form-factor
    • Air cooled architecture and instruments
    • Energy efficient, low power consumption
  • Applications

    • Power and power management
    • Automotive switches and sensors
    • Audio: CODECS, amplifiers
    • Printer drivers and motor controllers
    • Automotive microcontrollers
    • DSP: digital, mixed signal, analog
    • Converters: precision, high speed, embedded and audio
    • WLAN, WiMAX, DVB, LTE, CDMA, Edge, WCDMA, bluetooth & other emerging standards
    • Multiband RF power amplifiers, RF front end modules
    • Highly integrated mobility devices, including SiP, SoC and single chip cell phones
    • Application processor
    • Wireless baseband