Sense+ next generation automation platform for MEMS & Sensor is optimized for high test requirements and small and sensitive devices, achieving high throughput even for MEMS devices that require longer test times.

The Sense+ isolated architecture decouples the stimulus and test module from the handling system, enabling a significant increase in test accuracy and daily output compared to prior generation solutions.  This All-in-One-System delivers the full backend process in one tool with high throughput test and inspection of small, delicate devices while creating less work-in-progress and better cost of test.  Sense+ also provides customers the flexibility to reconfigure the system to test different sensors, thereby extending the useful life of the platform. Further, Sense+ automation platform supports handling and vision inspection of advanced MEMS such as wafer-level chip scale packages.

Sense+ system is designed for different MEMS & Sensor applications including inertial, microphone, microphone-loudspeaker, pressure⁽¹⁾, and magnet⁽¹⁾. The stimulus module can be used as a standalone unit for engineering or for low volume manufacturing with the possibility of later upgrading to a full production system. The Sense+ system offers all the flexibility of Cohu’s Turrets for loading from Wafer, Tray, Bowl, and Tube.

NV-Core Inspection System’s™ enhanced vision capabilities covers the entire process up to and including final inspection and packaging.

PAICe Digital Twin Platform™ provides real-time equipment monitoring and data analytics for increased productivity.

Sense+ delivers the highest test accuracy possible and a lower cost of test for MEMS in a balanced, complete system with up to 250 sites.

(1)  Roadmap