Cohu is a Bronze Sponsor and Exhibitor at the upcoming Semicon Southeast Asia. In addition, Cohu will present a technical paper on WLCSP advanced inspection challenges and solutions at the Product and System Level Testing Forum.
- Leading Edge Interfaces for State-of-the-Art Semiconductor Test Applications
- Infrared Inspection Module Demo for microscale defect detection
Come visit us at Cohu Booth #801 to learn more about our product and service offerings.
Do not miss our expert presentation at Product & System Level Testing Forum
Title: WLCSP advanced inspection challenges and solutions
Date: Thursday, May 9 @ 11.00 AM
Location: Level 1A MITEC
Speaker: Raul Arriola, Strategic Business Development Manager
Abstract: The continuous growth of product quality requirements in IoT, mobility and automotive markets, is driving the need for upstream detection of micro-crack defects on integrated circuits, not otherwise identifiable via electrical test.
This is growing segment in the semiconductor inspection as WLCSP content increases within advanced packaging.
Infra-Red (IR) imaging has the ability to see through silicon, inspecting the structure underneath the surface that is not otherwise observable with traditional inspection systems. In this seminar, Cohu will describe its breakthrough solution by integrating IR imaging onto a high-speed automation platform that delivers an economical solution for high quality inspection.